Staff Package Design Engineer

Job Title

Staff Package Design Engineer

Role Summary

Senior engineer responsible for design and development of semiconductor package and interconnect solutions for power and multi-chip applications (Power SiP/modules, flip-chip LGA, power QFN, multi-chip modules). The role works across product, reliability, quality and manufacturing partners to qualify packages and transition them into production.

Experience Level

Senior - typically 5 to 15 years of relevant package development experience.

Responsibilities

Contribute technical leadership to package design, process optimization, qualification, and production readiness for power and advanced interconnect packages.

• Design and develop package and interconnect methods for power SiP/modules, flip-chip, LGA, leadframe and multi-chip module packaging.
• Collaborate with OSAT/CM to plan and run DOEs, optimize processes, and establish process specifications.
• Work with Product Groups and Reliability to qualify new packages and processes within target schedules.
• Resolve process integration issues and establish production controls to ensure smooth transition to volume manufacturing.
• Maintain technical expertise on advanced leadframe, power SiP/modules, and flip-chip interconnect innovations.
• Investigate and address internal and external customer complaints in coordination with Marketing, Product, Quality, and Operations teams.

Requirements

Must-have technical skills and experience for successful performance in this role.

• 5–15 years of hands-on experience in package development with emphasis on leadframe, laminate, power QFN/SiP/module, flip-chip packaging, and wafer front-side/back-side metallization processing.
• Practical understanding of semiconductor power device package assembly processes, materials and failure modes.
• Experience with process qualification, SPC (statistical process control) and statistical analysis.
• Familiarity with design and documentation tools: AutoCAD, Excel, PowerPoint, Word.
• Strong interpersonal, written and verbal communication skills; strong analytical and presentation skills.
• Experience working with OSATs/CMs and cross-functional teams (Product, Reliability, Quality, Operations).

Education Requirements

Master's or Bachelor's degree in Physics, Chemistry, Mechanical Engineering, Electrical Engineering, Materials Engineering, or a closely related technical discipline.

About the Company

Company: Renesas

Headquarters: Hitachinaka, Japan

Renesas is a global leader in embedded semiconductor solutions, providing high-quality products across automotive, industrial, infrastructure, and IoT sectors. With over 22,000 employees in more than 30 countries, the company focuses on scalable solutions that enhance user experience and drive innovation while committed to sustainability and energy efficiency.