Staff Package Design Engineer
RenesasJob Title
Staff Package Design Engineer
Role Summary
Design and qualify semiconductor package and interconnect solutions focused on Power SiP/modules, wafer-level packaging, flip-chip and multi-chip module technologies. Work with product, reliability, quality and operations teams and external OSATs/CMs to move designs into production and support automotive, industrial and consumer power applications.
Experience Level
Senior-level; requires more than 6 years of relevant package development experience.
Responsibilities
Primary responsibilities include development, qualification and production support of packaging technologies.
- Benchmark, select and qualify materials, processes and external assembly subcontractors (OSAT) or contract manufacturers (CM).
- Develop and run DOE with OSAT/CM to optimize processes; establish process specifications and monitor process control.
- Qualify new packages and processes; address internal and external customer issues with cross-functional teams (Marketing, Product, Quality, Operations).
- Ensure smooth production transition and implement ramp-up monitoring to maintain quality during volume release.
- Participate in packaging roadmap development and maintain technical expertise on power SiP/modules, wafer-level packaging, flip-chip interconnects and panel-level packaging.
- Establish and maintain package design rules and perform package technology qualification for consumer, industrial and automotive power applications.
Requirements
Must-have technical skills and behaviors.
- More than 6 years experience in package development emphasizing power SiP/module, wafer-level and flip-chip packaging.
- Strong understanding of power SiP/modules, wafer-level and flip-chip packaging methods, and assembly processes.
- Experience with qualification methods, SPC and statistical analysis tools.
- Strong analytical, presentation, interpersonal and communication skills.
- Experience working with OSATs/CMs and cross-functional teams to drive process improvement and production readiness.
- Nice-to-have: knowledge of wire-bonding, multi-chip module technologies and GaN-related packaging.
Education Requirements
Doctorate, Master's or Bachelor's degree in Physics, Chemistry, Mechanical, Electrical or Materials Engineering.
About the Company
Company: Renesas
Headquarters: Hitachinaka, Japan
Renesas is a global leader in embedded semiconductor solutions, providing high-quality products across automotive, industrial, infrastructure, and IoT sectors. With over 22,000 employees in more than 30 countries, the company focuses on scalable solutions that enhance user experience and drive innovation while committed to sustainability and energy efficiency.
