Staff Package Design Engineer

Job Title

Staff Package Design Engineer

Role Summary

Join the advanced silicon packaging design and simulation team to deliver high-performance 2.5D/3D, chiplet-based, FCBGA, SiP, wire-bond and QFP/QFN packages. The role emphasizes package layout execution, manufacturability, and cross-domain co-design with silicon, SI/PI, thermal, and reliability teams.

Experience Level

Senior — minimum 6+ years of hands-on experience in package CAD layout and development.

Responsibilities

Primary responsibilities include full-package layout and release for manufacturing, cross-functional co-design, and maintaining accurate design databases and outputs.

• Perform package layout and development for 2.5D/3D IC, FCBGA, SiP, multi-die and chiplet-based designs.
• Develop and maintain package CAD databases; ensure adherence to design guidelines, DFM, and DFA.
• Manage end-to-end design cycle: schematic creation, netlist import, footprint assignment, and generation of manufacturing outputs (Gerbers, drill data, fabrication/assembly drawings).
• Create and modify substrate/RDL layouts, bump maps, escape routing, and power/ground structures.
• Collaborate with SI/PI, thermal, reliability, DFT, and silicon teams for co-design and participate in design reviews.
• Ensure designs comply with foundry, OSAT, and manufacturing design rules (DRC, LVS).
• Support ECO cycles, design updates, and version control throughout the project lifecycle.

Requirements

Must-have technical skills and experience; optional items noted below.

• Must have: 6+ years hands-on experience in package CAD layout and development.
• Must have: Experience with 2.5D/3D IC packaging, FCBGA, advanced substrate-based packages, and multi-die/chiplet designs.
• Must have: Proficiency with Cadence Allegro Package Designer (APD/SiP), Siemens Xpedition/Innovator, or equivalent tools.
• Must have: Experience with advanced manufacturing design rules and OSAT interfaces; DFM/DFA knowledge.
• Must have: Good understanding of Signal Integrity (SI), Power Integrity (PI), and high-speed design fundamentals.
• Must have: Strong communication, presentation, and documentation skills; ability to work effectively in cross-functional teams.
• Nice to have: Experience with thermal and reliability co-design, advanced packaging test, and DFT integration.

Education Requirements

Not specified.

About the Company

Company: Renesas

Headquarters: Hitachinaka, Japan

Renesas is a global leader in embedded semiconductor solutions, providing high-quality products across automotive, industrial, infrastructure, and IoT sectors. With over 22,000 employees in more than 30 countries, the company focuses on scalable solutions that enhance user experience and drive innovation while committed to sustainability and energy efficiency.