Staff ESD/Latch-up Engineer, HBM Design Architecture Organization
Micron TechnologyJob Title
Staff ESD/Latch-up Engineer, HBM Design Architecture Organization
Role Summary
Join Micron’s HBM Design Architecture team to define and implement ESD and latch-up protection for advanced DRAM and HBM products. The role works across design, packaging, reliability, and foundry partners to ensure product robustness from early design through high-volume manufacturing.
Primary focus: develop chip- and IP-level protection strategies, validate silicon, and drive sign-off criteria aligned with industry standards.
Experience Level
Senior (Staff level). No specific years of experience stated; role expects senior technical expertise and leadership.
Responsibilities
The engineer will own ESD and latch-up strategy and lead validation and cross-team coordination.
- Define chip- and IP-level ESD and latch-up strategies for HBM DRAM, base die, I/O, TSVs, and die-to-die interfaces.
- Establish ESD and latch-up requirements, targets, and sign-off criteria aligned with JEDEC/ESDA standards.
- Enable protection circuit implementation and latch-up–safe layout practices across designs and technologies.
- Lead silicon validation, failure analysis, and correlate pre-silicon assumptions to silicon results.
- Serve as technical interface to foundries and collaborate with design, packaging, reliability, and product teams.
Requirements
Must-have technical skills and experience; preferred items listed separately.
- Must-have: Strong fundamentals in ESD physics, latch-up mechanisms, and advanced CMOS device behavior.
- Hands-on experience with ESD protection circuits and latch-up prevention techniques.
- Practical experience with silicon validation, failure analysis, and debugging ESD/latch-up issues on silicon.
- Familiarity with JEDEC and ESDA standards, including HBM, CDM, and JESD78.
- Proven ability to work directly with foundry ESD/latch-up teams and cross-functional stakeholders.
- Nice-to-have: Experience supporting ESD/latch-up sign-off for advanced DRAM or HBM products; knowledge of SCR-based clamps, distributed ESD networks, and rail-based strategies; mentoring and influencing design methodology across teams.
Education Requirements
Master's degree or Ph.D. in Electrical Engineering, or equivalent industry experience. (Electrical Engineering specifically mentioned; equivalent practical experience accepted.)
About the Company
Company: Micron Technology
Headquarters: Boise, Idaho, USA
Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.
