Staff Engineer, Semi Packaging Engineering
Analog DevicesJob Title
Staff Engineer, Semi Packaging Engineering
Role Summary
Lead development and qualification of advanced semiconductor packaging solutions (wire-bond, flip-chip, SiP, module-based) that meet product requirements for reliability, manufacturability, and cost.
Work with cross-functional teams and external suppliers to define package architecture, perform mechanical and thermal analysis, and drive process and yield improvements.
Experience Level
Senior — typically requires 5+ years of hands-on experience in semiconductor packaging development, package simulation, or packaging manufacturing.
Responsibilities
Primary responsibilities for this role include:
- Lead design, development, and qualification of semiconductor packages and module-based products across market segments.
- Perform mechanical (FEM) simulations to evaluate chip-package and package-board interactions, warpage, stress, and reliability risks.
- Perform component- and system-level thermal simulations and advise on thermal architecture and mitigation.
- Provide technical leadership for package mechanical and thermal analysis to support architecture selection and design optimization.
- Define reliability criteria and qualification plans; collaborate with quality and reliability teams on qualification activities.
- Collaborate with OSAT partners, substrate suppliers, and materials vendors to resolve technical issues and drive process development.
- Develop and maintain package design guidelines, process specifications, simulation methodologies, and technical documentation.
Requirements
Must-have technical skills and experience:
- 5+ years of hands-on experience in semiconductor packaging development, package simulation, or packaging manufacturing.
- Strong understanding of IC packaging materials and their mechanical, thermal, and electrical behavior.
- Deep knowledge of IC package structures, substrate technologies, and semiconductor assembly processes.
- Hands-on experience with major FEM tools; experience with ANSYS preferred.
- Experience with thermal and signal-integrity tools is a plus (FloTHERM, Sigrity, Icepak).
- Familiarity with PCB/layout tools such as Cadence Allegro is a plus.
- Proven ability to work in cross-functional teams, influence technical decisions, and communicate technical results clearly.
- Ability to collaborate effectively with external suppliers and drive manufacturability and yield improvements.
- Willingness to travel (required up to ~10%).
Education Requirements
PhD or Master’s degree in Mechanical Engineering or Electrical Engineering (as stated in the posting).
About the Company
Company: Analog Devices
Headquarters: Norwood, Massachusetts, USA
Analog Devices is a leading global semiconductor company that bridges the physical and digital worlds, enabling breakthroughs at the Intelligent Edge. With a focus on innovation, ADI develops solutions that drive advancements in digitized factories, mobility, and digital healthcare. The company employs around 24,000 people globally and reported revenues exceeding $9 billion in FY24, creating technologies that transform lives across various sectors.
