Staff Engineer, Semi Packaging Engineering

Job Title

Staff Engineer, Semi Packaging Engineering

Role Summary

Lead the design, development, and qualification of advanced semiconductor packaging solutions (wire-bond, flip-chip, system-in-package, and module-based products). Work within the packaging engineering team to optimize package architecture for mechanical, thermal, reliability, and manufacturability targets.

The role requires technical leadership on mechanical and thermal analysis, cross-functional coordination with product, quality, and manufacturing teams, and collaboration with external partners (OSATs, substrate and material suppliers) to drive yield and process improvements.

Experience Level

Senior — typically requires 5+ years of hands-on experience in semiconductor packaging development, package simulation, or packaging manufacturing.

Responsibilities

Primary responsibilities include simulation, design, qualification, and cross-functional execution for semiconductor packages.

• Lead design, development, and qualification of package solutions across multiple product families.
• Perform mechanical FEM simulations to evaluate chip-package and package-board interactions, warpage, stress, and reliability risks.
• Perform component- and system-level thermal simulations for package thermal assessment and optimization.
• Provide technical leadership for package architecture selection and reliability risk assessments.
• Collaborate with OSAT partners, substrate suppliers, and material vendors to resolve technical issues and optimize manufacturing.
• Work with quality and reliability teams to define reliability criteria and qualification plans.
• Develop and maintain package design guidelines, process specifications, simulation methodologies, and technical documentation.
• Support cross-functional teams to translate product requirements into packaging solutions and to resolve complex technical issues.

Requirements

Core technical skills and experience required; listed items differentiate must-have and preferred capabilities.

• Must-have: 5+ years of hands-on experience in semiconductor packaging development, package simulation, or packaging manufacturing.
• Must-have: Strong understanding of IC packaging materials and their mechanical, thermal, and electrical behavior.
• Must-have: Strong knowledge of IC package structures, substrate technologies, and assembly processes.
• Must-have: Hands-on experience with major FEM tools (mechanical simulation); ANSYS experience preferred.
• Must-have: Strong analytical, problem-solving, communication, and collaboration skills; ability to influence cross-functional technical decisions.
• Must-have: Ability and willingness to travel (~10%).
• Preferred: Experience with FloTHERM, Sigrity, Icepak, or similar thermal/electrical simulation tools.
• Preferred: Experience with Cadence Allegro and working directly with OSATs and substrate/material vendors.
• Other: Candidates who are not U.S. citizens, U.S. permanent residents, or protected individuals may be subject to an export licensing review.

Education Requirements

PhD or Master’s degree in Mechanical Engineering or Electrical Engineering.

About the Company

Company: Analog Devices

Headquarters: Norwood, Massachusetts, USA

Analog Devices is a leading global semiconductor company that bridges the physical and digital worlds, enabling breakthroughs at the Intelligent Edge. With a focus on innovation, ADI develops solutions that drive advancements in digitized factories, mobility, and digital healthcare. The company employs around 24,000 people globally and reported revenues exceeding $9 billion in FY24, creating technologies that transform lives across various sectors.