Staff Engineer, Package Reliability

Job Title

Staff Engineer, Package Reliability

Role Summary

Responsible for package quality and reliability across DRAM and HBM product lines, from design review through production release. Works within Global Quality (GQ) to coordinate package qualification, monitor HVM, lead root-cause analysis, and recommend dispositions based on reliability data.

Experience Level

Senior level. The posting specifies at least 10 years of relevant experience in PWF, DCA and 3DS packaging.

Responsibilities

Provide technical leadership on package reliability and qualification activities, drive corrective actions, and ensure product release readiness.

• Plan and coordinate package qualification for new products, materials, designs, and processes.
• Design reliability test plans and interpret accelerated test results and life-prediction models.
• Monitor high-volume manufacturing (HVM) reliability metrics and participate in disposition decisions.
• Lead root-cause investigations and corrective actions for package-related failures.
• Prepare technical reports and present findings to cross-functional teams; support phase-gate reviews from design to production.
• Ensure CTQ compliance and inline validation of package processes and assemblies.
• Incorporate AI-assisted tools and digital analytics to improve testing, analysis, and reporting where appropriate.

Requirements

Core technical skills and domain experience required; additional preferred skills listed below.

• Must-have: Deep knowledge of semiconductor package assembly processes and reliability challenges, especially for HBM and 3DS packages.
• Must-have: Understanding of thermo-mechanical, thermal, mechanical, and hygroscopic swelling effects on package reliability.
• Must-have: Proven experience in PWF, DCA and 3DS packaging; direct HBM experience preferred.
• Must-have: Strong analytical problem-solving, attention to detail, and ability to work independently and cross-functionally.
• Preferred / Nice-to-have: Familiarity with industry reliability test methods, acceleration models, sampling statistics, and reliability modelling.
• Preferred / Nice-to-have: Experience with materials characterization, failure analysis, and memory assembly/testing processes.
• Preferred / Nice-to-have: Practical knowledge of backend manufacturing and analytics tools such as MAM, MES, JMP, and Tableau.

Education Requirements

Minimum: Bachelor's degree (BS) in Engineering or related field (examples: Electronics, Mechanical, Physics, Semiconductor, Materials) or equivalent qualification. Master's degree (MS) in Physics, Statistics, or Engineering fields or equivalent experience is noted as preferred. The posting allows equivalent practical experience in lieu of formal degrees.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.