Staff Engineer - Package Health System and Analytics

Job Title

Staff Engineer - Package Health System and Analytics

Role Summary

The Package Health Analyst develops and executes package health monitoring, simulation, and characterization activities to ensure robust packaging solutions. The role involves hands-on engineering work spanning defect detection, data analysis, reliability testing, and building traceability across wafer, assembly, and test stages.

Experience Level

Mid-level (3+ years of relevant semiconductor experience preferred).

Responsibilities

Key responsibilities include designing monitoring systems, characterizing defects, and building analytics to support yield and reliability.

• Define quantitative package health metrics and develop continuous monitoring dashboards.
• Perform electrical and mechanical characterization of packages.
• Implement real-time defect detection and classification; perform next-level characterization for critical defects.
• Conduct correlation and causation analyses between process variables, defect patterns, and reliability outcomes.
• Develop data pipelines and tools to link process parameters, equipment signals, and defect signatures for end-to-end traceability.
• Build and maintain a structured knowledge base to capture package health learnings and support NPI handover.
• Collaborate with process, equipment, and reliability engineers to integrate findings into predictive models and production processes.

Requirements

Minimum qualifications and technical skills.

• 3+ years' experience in the semiconductor industry; experience in packaging, test, or reliability engineering preferred.
• Strong data analytics and statistical modeling capabilities.
• Strong understanding of semiconductor packaging processes and material interactions.
• Ability to work cross-functionally with process, equipment, and reliability teams.
• Experience developing monitoring dashboards and engineering data pipelines or equivalent tools.

Nice-to-have:

• Proficiency in Python or R for data analysis and visualization.
• Experience with AI/ML tools or statistical modeling.
• Knowledge of defect inspection systems and inline metrology.
• Familiarity with advanced packaging technologies (HBM, hybrid bonding, 2.5D/3D stacking).
• Strong problem-solving and documentation skills.

Education Requirements

Bachelor's or Master's degree in Electrical Engineering, Materials Science, or a related field.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.