Staff Engineer, HIG-HBM Product Engineering (Media Health Reliability)

Job Title

Staff Engineer, HIG-HBM Product Engineering (Media Health Reliability)

Role Summary

Lead reliability engineering for HBM products at Fab 10A in Singapore, focusing on test-flow development, qualification, root-cause analysis, and production readiness. Collaborate across Fab, technology, design, system, and quality teams to reduce DPM, improve intrinsic reliability, and support process conversions.

Experience Level

Senior-level role. The posting requests 5+ years of semiconductor industry experience in product, testing, or reliability.

Responsibilities

Accountable for product reliability strategy, qualification, failure analysis, and technical leadership within HBM product engineering.

• Define and develop reliability stress tests, test flows, and qualification test plans.
• Coordinate qualification planning and execution with Global Quality; track progress and resolve gating issues.
• Drive reductions in Extrinsic (Time 0, Field DPM) and Intrinsic reliability defects via optimized manufacturing test flows and strategies.
• Lead root-cause analysis for reliability and RMA issues using electrical (EFA) and physical failure analysis (PFA); drive corrective actions.
• Provide recommendations for process conversions and high-volume manufacturing to improve yield, cost, reliability, and performance.
• Manage technical risk with product leads and prioritize projects based on reliability impact.
• Promote innovation and mentor engineers; develop project management and decision-making capabilities in the team.
• Identify and pilot high-leverage AI/ML use cases for reliability; partner to productionize solutions.
• Apply machine learning (regression, classification, anomaly detection, clustering) to reliability datasets to segment failures and detect outliers.

Requirements

Must-have skills and experience required for effective performance in this role.

• 5+ years in the semiconductor industry with product, testing, or reliability experience.
• Solid problem-solving and root-cause analysis skills; experience driving technical resolutions across functions.
• Familiarity with CMOS technology, DRAM architecture, and basic device physics.
• Experience with data analysis, statistics, and scripting (Python, JMP or similar).
• Experience with reliability qualification planning, test execution, and manufacturing/test flow optimization.
• Experience with electrical and physical failure analysis methods preferred.
• Strong written and verbal communication, attention to detail, and ability to work in cross-functional teams.
• Demonstrated ability to mentor others and lead technical decisions and project prioritization.
• Experience applying ML/AI tools to engineering datasets and coaching teams on AI adoption is strongly preferred.

Education Requirements

Bachelor's or Master’s degree in Electrical and Electronics Engineering or a related field. Coursework or internship experience in semiconductor devices, circuit design, or product validation is listed as a plus.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.