Staff Electronics SI/PI Engineer

Job Title

Staff Electronics SI/PI Engineer

Role Summary

Join the Packaging, Boards and Multiphysics team to lead system-level signal integrity (SI) and power integrity (PI) analysis for SoC-to-board integration in hardware platform prototypes that validate Arm IP. Work cross-functionally with chip packaging, PCB design, and electrical validation teams to ensure performance and reliability of embedded compute platforms.

Experience Level

Senior — the role expects senior-level expertise; the posting specifies approximately 10 years of industry experience.

Responsibilities

Lead and execute SI and PI activities at system level across silicon, package and PCB; collaborate with cross-geography engineering teams to influence design and validate performance.

• Perform system-level SI and PI analysis covering silicon, package and board.
• Define and validate routing strategies, layer stack-ups, and design rules for signal and power integrity.
• Lead timing and interface signal integrity analysis to meet interface timing and signal-quality targets.
• Perform board/system power delivery network AC and DC simulations for low-voltage, high-current supplies.
• Collaborate with packaging and PCB design teams to optimize pinouts, routing feasibility and layer trade-offs.
• Support post-silicon correlation with electrical validation teams.

Requirements

Must-have skills and experience required for the role; a short list of desirable additions follows.

• Approximately 10 years of industry experience in hardware, electronics or embedded compute.
• Deep knowledge of high-speed signal and power integrity and timing analysis across silicon, package and board; experience with electromagnetic modeling of 3-D structures.
• Proven SI analysis experience for high-density SoCs and high-speed interfaces.
• Detailed understanding of high-speed interfaces (examples: PCIe Gen5/6/7, DDR4/5, LPDDR4/5/5x/6, USB, Ethernet).
• Familiarity with IC packaging technologies and their PCB impact; ability to influence SoC pin-outs and perform layer trade-off analysis.
• Understanding of PCB fabrication (PTH, HDI), stack-up/via topologies and substrate materials.
• Proficiency with SI/PI and PCB layout tools such as ANSYS, Siemens EDA, Cadence Allegro PCB suite and OrCAD CIS.
• Strong communication and collaboration skills; attention to detail.

Nice-to-have

• Design automation and scripting experience.
• Embedded hardware debug experience with lab equipment (oscilloscopes, VNAs).
• Experience working across geographies and with multiple teams.

Education Requirements

Not specified.

About the Company

Company: Arm

Headquarters: Cambridge, United Kingdom

ARM is a global leader in semiconductor and software design, driving innovation in computing technology. The company specializes in designing processors and systems that provide the essential building blocks for electronic devices. ARM's architecture is widely used in smartphones, servers, and IoT devices, and its collaborative culture fosters bold thinking, diversity, and high-impact benefits for its talented workforce.