Staff Board Package Design Engineer

Job Title

Staff Board Package Design Engineer

Role Summary

Lead board and IC package design for high-performance SoCs/MCUs. Responsible for driving designs from specification through release, coordinating cross-functional activities, and ensuring manufacturability and product readiness.

Small summary: influence board/package architecture and execution for embedded products in automotive, industrial and IoT markets.

Experience Level

Senior — 7 to 10 years of hardware engineering experience.

Responsibilities

Primary accountabilities for the role:

• Lead end-to-end board and IC package design from block level to final delivery.
• Define, develop and execute product plans and specifications through release.
• Drive schematic, layout and BOM generation and handoff to manufacturing.
• Specify and verify system power, clocking, modes and debug features.
• Oversee SI/PI and thermal verification and ensure signal integrity and power distribution.
• Coordinate SoC bring-up, system integration and cross-functional validation.
• Ensure designs meet DFM/DFA, assembly rules, and manufacturing process requirements.
• Mentor and lead team members, promote productivity and technical quality.
• Automate SI/PI and packaging workflows where appropriate.

Requirements

Must-have technical experience and skills; preferred items listed separately.

• Proven experience with microcontroller and microprocessor based complex system designs.
• Experience with packaging technologies and manufacturing processes.
• Strong domain knowledge of system clocking, power management, system modes and debug.
• Practical experience with PCB technologies, stackup design, materials, assembly rules and DFM/DFA.
• Experience producing schematics, layouts and BOMs using modern CAD tools.
• Ability to work independently and to lead and coordinate multi-disciplinary teams.
• Nice-to-have: high-speed interfaces (PCIe Gen3/4/5, LPDDR4/4x/5/5x, UFS, Ethernet, Flash), PMIC and system power supply design.
• Nice-to-have: familiarity with SI/PI and packaging tools (Ansys HFSS, Cadence SI/PI, SIwave, Cadence APD, HSPICE, ADS, Q3D) and thermal simulation.
• Nice-to-have: experience in advanced packaging (SiP, flip-chip, 3D packaging) and semiconductor packaging assembly processes.
• Nice-to-have: scripting/automation skills (Python, TCL) for SI/PI and packaging workflows.

Education Requirements

M.Tech or B.Tech in Electronics/Electrical/Computer Science (MTech/BTech in EC/EE/CS specified in the posting). No alternate equivalent-degree language specified.

About the Company

Company: Renesas

Headquarters: Hitachinaka, Japan

Renesas is a global leader in embedded semiconductor solutions, providing high-quality products across automotive, industrial, infrastructure, and IoT sectors. With over 22,000 employees in more than 30 countries, the company focuses on scalable solutions that enhance user experience and drive innovation while committed to sustainability and energy efficiency.