Staff Board - Package Co-design Engineer

Job Title

Staff Board - Package Co-design Engineer

Role Summary

Senior electronics engineer focused on PCB and silicon-package co-design within Arm's Packaging, Boards and Multiphysics team. The role delivers physical hardware platforms and prototypes used for software development, validation, and customer engagement for Arm IP.

Work includes defining PCB and package interfaces, influencing SoC pinouts and system-level feasibility, and coordinating with cross-functional teams and manufacturing partners to produce reliable, manufacturable boards.

Experience Level

Senior-level (Staff). Years of experience not specified.

Responsibilities

Key responsibilities include system-level PCB and package co-design, driving layout strategy, and supporting early silicon validation.

• Collaborate across engineering teams and geographies to define PCB-package integration and influence silicon architecture and package pinout trade-offs.
• Drive PCB development alongside chip packaging teams: breakout and routing strategies, design rules, layer optimization and manufacturability trade-offs.
• Analyze and optimize high-speed signal paths and power delivery to ensure signal integrity and reliability at system level.
• Perform escape routing analysis and estimate routable IO counts for given stack-ups and design rules.
• Evaluate package pinout options against PCB routability, SI/PI performance, layer count, cost and manufacturability.
• Support early board architecture planning: component placement, PDN strategy, form-factor constraints and routing feasibility.
• Provide schedule estimates and technical justifications to program teams.
• Coordinate with PCB fabricators and contract electronic manufacturers (CEMs) to assess manufacturability of advanced PCB technologies.

Requirements

Must-have technical skills and experience for immediate contribution, followed by desirable skills.

• Strong understanding of electronics and embedded compute systems.
• Familiarity with IC packaging technologies and their impact on PCB design; proven experience collaborating with chip packaging teams to influence SoC pinouts.
• Detailed knowledge of high-speed interfaces and standards (e.g. PCIe, LPDDR) and methods to preserve signal quality at high speeds.
• Expertise in escape routing analysis for high-density SoCs; able to estimate IO routability for specific stack-ups and rule sets.
• Extensive signal integrity (SI) and power integrity (PI) analysis techniques from board and package perspectives.
• Understanding of PCB fabrication processes (PTH, HDI), stack-up and via topologies; ability to assess manufacturability.
• Proficiency with EDA tools for schematic entry and PCB layout (Cadence OrCAD and Allegro).
• Good communication, collaboration skills, attention to detail, and a practical, solution-oriented approach.

Nice-to-have:

• Experience with SI tools (ANSYS, Siemens EDA, etc.).
• Experience with design automation, scripting, or layout tooling automation.
• Prior work across distributed teams and multiple geographies.

Education Requirements

Not specified.

About the Company

Company: Arm

Headquarters: Cambridge, United Kingdom

ARM is a global leader in semiconductor and software design, driving innovation in computing technology. The company specializes in designing processors and systems that provide the essential building blocks for electronic devices. ARM's architecture is widely used in smartphones, servers, and IoT devices, and its collaborative culture fosters bold thinking, diversity, and high-impact benefits for its talented workforce.