Sr. Staff / Staff Board Package Design Engineer
RenesasJob Title
Sr. Staff / Staff Board Package Design Engineer
Role Summary
Lead board and IC package design for high-performance SoCs and MCUs. Responsible for defining, developing and delivering board and package designs from block-level through final manufacturing release.
Provide technical leadership across cross-functional teams to ensure product readiness and successful manufacturing handoff.
Experience Level
Senior — 7 to 15 years of hardware engineering experience in board and package design for SoCs/MCUs.
Responsibilities
Primary responsibilities include technical leadership, design delivery, and team coordination.
- Lead board and package design from block-level through final delivery and manufacturing handoff.
- Define product and system-level specifications, including power, clocking, and interface requirements.
- Drive cross-functional teams to execute product plans from specification to release with minimal supervision.
- Support SoC bring-up, debug, validation, and resolution of system-level issues.
- Mentor and guide engineering team members; foster productive collaboration and knowledge sharing.
Requirements
Must-have technical skills and experience; preferred items listed separately.
- 7–15 years of hardware engineering experience working on microcontroller or microprocessor-based systems.
- Proven experience in board and IC package design and delivery, including schematic, layout, and BOM generation.
- Strong domain knowledge of system clocking, power management, system modes, and debug methodologies.
- Experience with PCB technologies, stackup design, DFM/DFT, assembly rules, and manufacturing processes.
- Ability to work independently and lead technical teams to deliver complex designs.
- Preferred: Design of SOC/system power supplies, PMIC specifications, and board-level DC/AC simulations.
- Preferred: Experience with high-speed interfaces (PCIe Gen3/4/5, LPDDR4/4x/5/5x, UFS, Ethernet, flash) and SI/PI tools (Ansys HFSS, Cadence SI/PI, SIwave).
- Preferred: IC package layout and advanced packaging (SiP, flip-chip, 3D packaging), thermal simulation, and automation scripting (Python, TCL).
Education Requirements
MTech or BTech in Electronics / Electrical / Computer Engineering or Computer Science (MTech/BTech in EC, EE, CS) as specified in the posting.
About the Company
Company: Renesas
Headquarters: Hitachinaka, Japan
Renesas is a global leader in embedded semiconductor solutions, providing high-quality products across automotive, industrial, infrastructure, and IoT sectors. With over 22,000 employees in more than 30 countries, the company focuses on scalable solutions that enhance user experience and drive innovation while committed to sustainability and energy efficiency.
