Sr. Staff Project/Program Design

Job Title

Sr. Staff Project/Program Design

Role Summary

Lead cross-functional New Product Introduction (NPI) programs for semiconductor power products from concept through market launch, ensuring ramp readiness, cost efficiency, and quality across global manufacturing and supply chain partners.

Work with Design, Validation, Product & Test Engineering, Firmware/Software, Operations, Supply Chain, Procurement, Packaging, and Quality to drive on-time, on-spec releases and scalable production.

Experience Level

Senior-level. Requires extensive semiconductor industry experience (see Requirements for details).

Responsibilities

Deliver program management and execution across the full product lifecycle.

• Lead cross-functional teams to plan, track, and execute NPI product releases and capacity-expansion initiatives.
• Manage end-to-end program planning from concept to market launch, including ramp readiness and safe launch activities.
• Coordinate wafer fabrication, assembly, test operations, and material logistics to meet schedule, cost, and quality targets.
• Conduct formal Project Gate reviews and provide structured updates to leadership on status, risks, and recommended actions.
• Identify risks early and implement mitigation strategies; drive data-driven decision-making.
• Align Engineering, Operations, and Supply Chain to support scalable production across global sites and OSAT partners.
• Drive process scalability and global process standardization to improve execution discipline.
• Communicate milestones, sample timelines, reliability testing, and product release status to stakeholders; build strong internal and external relationships.

Requirements

Core required skills and experience for successful candidates.

• Minimum 12+ years of semiconductor industry experience with strong knowledge of the full product lifecycle.
• At least 6+ years as an NPI Program Manager or equivalent program leadership role; experience with module and smart power stages programs preferred.
• Deep understanding of semiconductor manufacturing flows, production processes, package architectures, and diverse package types; prior fab or assembly site process/integration experience is a plus.
• Proven track record leading complex, cross-functional programs in fast-paced, ambiguous environments.
• Strong stakeholder management, communication, collaboration, and partnership skills across Engineering, Operations, Supply Chain, and OSAT partners.
• Highly analytical with strong organizational, problem-solving, time-management, and multitasking abilities.
• Proficient with Microsoft Office and modern project management tools; fast learner for new tools and systems.
• Self-driven, inquisitive, and committed to continuous personal and professional development.

Education Requirements

Bachelor's or Master's degree in Electrical Engineering expected; PhD preferred. Foundational program/project management training or certification is mentioned as desirable.

About the Company

Company: Renesas

Headquarters: Hitachinaka, Japan

Renesas is a global leader in embedded semiconductor solutions, providing high-quality products across automotive, industrial, infrastructure, and IoT sectors. With over 22,000 employees in more than 30 countries, the company focuses on scalable solutions that enhance user experience and drive innovation while committed to sustainability and energy efficiency.