Sr. Staff Package Design Engineer

Job Title

Sr. Staff Package Design Engineer

Role Summary

Lead package design for advanced IP test chips, owning substrate layout, electrical model extraction, SI/PI validation, and cross‑team integration from requirements through delivery. Work closely with internal teams, customers, and external partners to ensure designs meet electrical, manufacturability, and cost targets.

Use 3D EM tools (e.g., Ansys HFSS) and industry EDA tools to validate architectures and reduce iteration cycles.

Experience Level

Senior - requires 10+ years of hands‑on experience in semiconductor package design, substrate layout, electrical modeling, or a closely related field.

Responsibilities

Key responsibilities include:

• Lead 4–6 test‑chip package designs per year from requirements definition through final delivery, coordinating stakeholders and external partners.
• Define package requirements early (bump/ball maps, layer stackups) to optimize SI and PI performance.
• Perform hands‑on physical design and layout of advanced package substrates using industry EDA tools.
• Extract electrical models from substrate designs using 3D EM simulation tools and validate them against SI/PI requirements.
• Analyze package architectures, perform trade‑off studies, and recommend implementation options for IP integration.
• Resolve complex package integration issues with technically sound, manufacturable solutions.
• Provide regular project status, technical risk assessments, dependencies, and mitigation plans to management.

Requirements

Must-have qualifications and skills:

• 10+ years of hands‑on experience in semiconductor package design, substrate layout, electrical modeling, or closely related work.
• Strong understanding of circuit theory and transmission line behavior applied to high‑speed package interconnects.
• Demonstrated experience building, validating, and interpreting 3D electromagnetic models using Ansys HFSS or comparable tools.
• Strong written and verbal communication skills in English; able to explain technical tradeoffs to customers and cross‑functional teams.
• Working knowledge of Windows and Linux engineering environments and workflows.
• Nice-to-have: experience with advanced packaging technologies such as 2.5D interposers, fan‑out wafer‑level packaging, or chiplet integration.

Education Requirements

Bachelor's degree in electrical engineering, electronics engineering, or a closely related field, or equivalent practical experience.

About the Company

Company: Synopsys

Headquarters: Mountain View, California, USA

Synopsys is a leading company in electronic design automation (EDA) and semiconductor IP solutions. It provides tools and services for designing and verifying complex semiconductor devices and systems. The company plays a pivotal role in the semiconductor industry, helping engineers innovate and deliver higher-quality products faster. Synopsys is committed to advancing technology standards and offers a range of software and hardware solutions to its clients globally.