Sr Staff or Principal Thermal Engineer, Server Packaging
QualcommJob Title
Sr Staff or Principal Thermal Engineer, Server Packaging
Role Summary
Join Qualcomm's Data Center team to develop thermal solutions for high-performance server products at the package and system levels. The role leads thermal architecture and validation from simulation through lab test to production-ready designs.
Compensation range (posted): $180,400 - $270,600 USD (annual). Detailed benefits are provided by the employer.
Experience Level
Senior — 10+ years of industry experience in electronics cooling for server products.
Responsibilities
Lead and execute thermal engineering activities across design, simulation, and test for server packaging.
- Lead thermal architecture solutions using simulation and test; coordinate with cross-functional stakeholders.
- Perform CFD simulations from die to ambient throughout product development.
- Drive technical strategy, present tradeoffs, and lead thermal design reviews.
- Develop automation and custom software for thermal modeling and testing.
- Design and execute laboratory thermal tests; validate and characterize models.
- Analyze, document, and present simulation and test results to stakeholders.
Requirements
Must-have technical skills and experience for immediate contribution; desirable items listed as nice-to-have.
- Must have: 10+ years experience in electronics cooling for server products and proven thermal design/test delivery.
- Must have: Deep knowledge of thermal management elements (TIM, spreaders, heatsinks, vapor chambers, heat pipes, fans).
- Must have: Proficiency in CFD simulation and tools such as ANSYS Icepak and Celsius EC.
- Must have: Ability to write scripts or small programs for data analysis and tool automation (Python, C/C++, MATLAB, etc.).
- Must have: Hands-on experience designing and executing thermal tests; familiarity with airflow and temperature measurement equipment.
- Must have: Strong written and verbal communication, presentation, and negotiation skills.
- Nice to have: Industry exposure to 2.5D/3D packaging and experience with 3D CAD tools (SolidWorks, Creo).
- Nice to have: Some familiarity with AI/ML concepts and their application to analysis or modeling.
Education Requirements
Required: MS in Mechanical Engineering. Preferred: PhD in Mechanical Engineering.
About the Company
Company: Qualcomm
Headquarters: San Diego, California, United States
Qualcomm is a global leader in semiconductor and telecommunications equipment, specializing in mobile technologies and innovations. Known for its Adreno GPUs, the company provides solutions enabling advancements in mobile gaming, AI, VR/AR, and autonomous driving. Qualcomm's cutting-edge technology and commitment to high-performance, power-efficient designs drive the evolution of mobile graphics and connectivity worldwide.
