Sr Principal Packaging Engineer

Job Title

Sr Principal Packaging Engineer

Role Summary

Senior technical lead on the New Product Development and Operations team responsible for defining package technology roadmap and delivering semiconductor packaging solutions for automotive and industrial products. The role leads advanced package design, supplier qualification, manufacturability and cost optimization, and manages OSAT partners for back-end assembly and packaging.

Experience Level

Senior - requires extensive experience; this role specifies greater than 15 years of relevant packaging design and technology experience.

Responsibilities

Core responsibilities include package design, supplier management, simulation-based verification, and cross-functional coordination from concept through high-volume production.

• Define and implement package technology roadmap and package solutions to meet product requirements.
• Design, develop and qualify package architectures (QFN, FCBGA, WLCSP, flip-chip, modules, chiplets).
• Select and optimize package materials and BOM to meet quality, reliability and cost targets.
• Evaluate and optimize assembly flows to reduce cost and improve process efficiency.
• Conduct co-simulation and feasibility studies (electrical, thermal, mechanical) using industry tools to validate solutions.
• Engage, qualify and manage primary and second-source OSAT and supplier relationships; procure competitive quotes during product planning.
• Collaborate with silicon design, reliability, package design and manufacturing across tape-out, qualification and production ramp.
• Lead root-cause analysis, corrective actions and verification for package and assembly yield and reliability issues.
• Support Environmental, Health, Safety & Security requirements in all activities.

Requirements

Key technical and leadership requirements (must-have):

• Demonstrated expertise in package technologies and families, including flip-chip, WLCSP, FCBGA, and advanced architectures (modules, chiplets).
• Hands-on experience with package- and board-level simulation tools such as Cadence, Synopsys, Ansys and HFSS.
• Strong understanding of package assembly manufacturing flows and reliability standards.
• Proven experience leading technical engagements with foundry and OSAT partners for package development, qualification and assembly production.
• Ability to lead global, cross-disciplinary teams and communicate with customers, suppliers and internal stakeholders.
• Ability to produce clear product requirements, package architecture specifications and design documentation.

Education Requirements

MS or BS degree in Electrical Engineering or Mechanical Engineering. The posting specifies a requirement of more than 15 years of experience in package design and package technologies.

About the Company

Company: GlobalFoundries

Headquarters: Saratoga Springs, New York, USA

GlobalFoundries is a leading contract manufacturer for the global semiconductor industry, with facilities in multiple countries, including the USA. The company develops a broad portfolio of semiconductor technologies and employs around 13,000 people worldwide. GlobalFoundries focuses on enhancing competitiveness in specialized application solutions and fostering innovation in mobile communications, consumer electronics, and automotive applications.