Sr Architect, Technical Product Manager (3DIC Packaging)

Job Title

Sr Architect, Technical Product Manager (3DIC Packaging)

Role Summary

Lead technical product management for multi-die and advanced IC packaging solutions. Define the technical roadmap, specify detailed requirements, and validate solutions with engineering teams, customers, foundries, OSATs, and ecosystem partners.

Work hands-on with engineering to deliver package design, SI/PI, thermal and mechanical analysis, and production tapeout capabilities that meet production requirements.

Experience Level

Senior-level. Requires 15+ years of semiconductor IC and packaging experience.

Responsibilities

Own technical product strategy and execution for multi-die/package design and signoff.

• Develop technical roadmap for multi-die package design, analysis, and production tapeout.
• Engage with customers, foundries, and OSATs to translate packaging challenges into prioritized requirements.
• Evaluate competitive technologies and emerging methodologies to guide roadmap priorities.
• Define capabilities, assess technical tradeoffs, and validate solutions with engineering teams across silicon, package, and substrate flows.
• Drive cross-functional delivery addressing implementation, SI/PI, multiphysics, and manufacturing challenges.
• Advance AI-driven workflows for multi-die design, multiphysics analysis, and optimization.
• Present technical product vision to executives, customers, and ecosystem partners; represent the company in industry and standards engagements.
• Provide technical direction to field teams supporting customer evaluations and deployments.

Requirements

Must-have qualifications and domain expertise.

• 15+ years of semiconductor IC and packaging experience.
• Deep knowledge of IC and package design, analysis, manufacturing, and production tapeout.
• Hands-on experience with silicon and package design tools and SI/PI analysis tools.
• Expertise in signal integrity, power integrity, EMIR, thermal, and mechanical analysis for advanced packages.
• Experience with 2.5D/3DIC, chiplets, HBM, photonics, and co-packaged optics architectures.
• Familiarity with high-speed interfaces (PCIe, DDR, HBM) in package design and signoff contexts.
• Proven ability to translate complex technical challenges into requirements and roadmap priorities.

Nice-to-have: experience advancing AI-driven or agentic workflows for design automation and optimization; prior collaboration with hyperscalers or large design service providers.

Education Requirements

Not specified.

About the Company

Company: Synopsys

Headquarters: Mountain View, California, USA

Synopsys is a leading company in electronic design automation (EDA) and semiconductor IP solutions. It provides tools and services for designing and verifying complex semiconductor devices and systems. The company plays a pivotal role in the semiconductor industry, helping engineers innovate and deliver higher-quality products faster. Synopsys is committed to advancing technology standards and offers a range of software and hardware solutions to its clients globally.