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Software Engineering PhD Intern (2027)

Intel Corporation
October 2, 2026
Internship
On-site
Hillsboro, Oregon, United States
$149,598 - $149,602 USD yearly
EDA Jobs, Level - Entry or Early Career

Job Title

Software Engineering PhD Intern (2027)

Role Summary

The Software Research Intern (PhD) will join the TCAD Process Reliability Modeling team within Intel Foundry to develop computational software and simulation methods that support semiconductor process and reliability engineering.

Work focuses on simulation and modeling of chip-package interactions, thermal transport and management, thin film deposition and patterning, and delivering scalable solutions in collaboration with multidisciplinary teams. This role requires on-site presence in Hillsboro, OR.

Experience Level

Entry-level intern role intended for current full-time PhD students.

Responsibilities

Primary responsibilities include:

  • Design, develop, and optimize software for engineering and research applications.
  • Implement numerical simulation capabilities (finite element, level-set, or related techniques).
  • Develop modeling-based methodologies for device, interconnect, module and reliability problems.
  • Define input criteria and validation methods for simulation results.
  • Collaborate with software engineers, researchers, and domain experts to deliver scalable, maintainable solutions.
  • Document technical solutions and present findings to project stakeholders.

Requirements

Must-have and preferred technical skills; degree and academic requirements are listed under Education Requirements.

  • Must-have: 1+ year programming experience in C, C++ or Python and demonstrable software development and analytical skills.
  • Must-have: Experience with numerical methods or simulation software (implementation or practical usage).
  • Preferred: Experience using TCAD or atomistic simulation tools for thermo-mechanical, thermal transport, thin film, patterning, or chip/package interaction studies.
  • Preferred: Hands-on experience developing or using finite element or equivalent solvers for physical systems.
  • Preferred: Experience with physics-based modeling or AI/ML techniques applied to solid mechanics, thermal management, reliability, or manufacturing process analysis.

Education Requirements

Must be a full-time Ph.D. student in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, or a related semiconductor field. Minimum cumulative GPA of 3.0 required.


About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.

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Date Posted: 2026-10-01