Software Engineer 3

Job Title

Software Engineer 3

Role Summary

Design, develop, and optimize low-level software components for advanced semiconductor equipment. Work across the full software development lifecycle with cross-functional engineering teams to translate customer requirements into implemented solutions.

Primary focus on .NET applications, hardware interfaces, and reliable client-server communication.

Experience Level

Mid-level - expects 2+ years of professional software development experience, particularly with .NET and C#.

Responsibilities

Key responsibilities include:

• Collaborate with cross-functional teams to translate customer needs into technical requirements.
• Design, implement, and maintain .NET applications using C# and WPF.
• Develop client-server communication using WCF, TCP/IP, and related protocols.
• Implement and integrate low-level hardware control interfaces over TCP/IP, serial, or similar links.
• Participate in code reviews, unit testing, and system integration activities.
• Contribute to continuous improvement of software architecture and development processes.

Requirements

Must-have technical skills and experience:

• 2+ years professional experience with .NET and C#.
• Strong understanding of object-oriented programming and design patterns.
• Experience with WPF for GUI design and implementation.
• Proficiency with client/server technologies such as WCF and TCP/IP.
• Experience interfacing with hardware via TCP/IP, serial, or other communication protocols.
• Familiarity with Agile/SCRUM methodologies and version control (Git).
• Excellent communication, teamwork, and time-management skills.
• Knowledge of metrology tools and SEMI industry standards is a plus.

Education Requirements

Bachelor's or Master's degree in Computer Science, Mathematics, Physics, or a related engineering discipline.

About the Company

Company: Onto Innovation

Headquarters: Wilmington, MA, United States

Onto Innovation develops process-control solutions for the semiconductor industry, offering optical inspection, 3D metrology, defect inspection, composition analysis, factory analytics, and lithography technologies to improve yield, performance, and reliability across the semiconductor value chain.