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Software Engineer 3

Onto Innovation
September 14, 2026
Full-time
On-site
Wilmington, Massachusetts, United States
$96,800 - $145,200 USD yearly
Other Semiconductor Jobs, Level - Mid-Career

Job Title

Software Engineer 3

Role Summary

The Software Engineer III will develop software for next-generation semiconductor inspection and metrology equipment, with a primary focus on motion control and defect-detection algorithms. The role is based on the Jonspin team in Wilmington, MA and covers design, system integration, and customer support for precision equipment.

Experience Level

Mid-level - typically requires around 3+ years of relevant software development experience.

Responsibilities

Implement and validate software for motion control and metrology subsystems; support system integration and customer evaluations.

  • Translate customer and product requirements into functional specifications.
  • Design and implement algorithms for defect detection and metrology.
  • Design and implement software for motion control subsystems and perform motion profile tuning.
  • Conduct design verification and system-level integration testing.
  • Present technical solutions to application and product management teams.
  • Support beta installations and evaluations at customer sites.

Requirements

Core technical requirements; "Nice-to-have" items are preferred but not mandatory.

  • Must-have: Approximately 3 years of C++/C# software development experience.
  • Must-have: Experience controlling mechanical and electrical systems.
  • Must-have: Experience with motion control, motion tuning, and DIO.
  • Must-have: Willingness to travel internationally up to 20%.
  • Nice-to-have: Experience in semiconductor capital equipment development.

Education Requirements

Bachelor's degree in Computer Science or equivalent practical experience.


About the Company

Company: Onto Innovation

Headquarters: Wilmington, MA, United States

Onto Innovation develops process-control solutions for the semiconductor industry, offering optical inspection, 3D metrology, defect inspection, composition analysis, factory analytics, and lithography technologies to improve yield, performance, and reliability across the semiconductor value chain.

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Date Posted: 2026-09-11