SOC Thermal Engineer

Job Title

SOC Thermal Engineer

Role Summary

The SOC Thermal Engineer designs and validates cooling and thermal management solutions for high-performance mobile SoCs and semiconductor packages. Works with multi-functional teams across IC design, packaging, and product engineering to ensure thermal performance, reliability, and to support advanced IC packaging research and development.

Experience Level

Mid-level (Level - Mid-Career). The posting does not specify required years; typical candidates have roughly 3–7 years of relevant experience.

Responsibilities

The role focuses on thermal modeling, simulation, testing, and integration of cooling solutions for SoCs and packages.

• Develop and validate thermal solutions and cooling concepts for mobile SoCs and system-level designs.
• Create and run thermal simulations at silicon die and package levels; analyze results to guide design decisions.
• Design and execute experimental thermal test setups and measurement campaigns; analyze thermal data.
• Integrate cooling solutions into system and SoC architecture to meet performance and reliability targets.
• Collaborate with IC designers, package engineers, and product teams throughout development.
• Contribute to R&D on advanced IC packaging and thermal assembly processes.

Requirements

Core technical requirements and preferred skills.

• Must-have: Proven experience in thermal analysis and design for silicon devices and semiconductor packages, including modeling and validation of cooling solutions.
• Must-have: Hands-on experience with thermal testing and analysis for semiconductor devices, packages, PCBs, or mobile products.
• Must-have: Ability to run and interpret thermal simulations and measurement data to improve product thermal management.
• Must-have: Strong cross-functional collaboration and communication skills.
• Nice-to-have: Leadership experience at the senior engineer level and demonstrated technical leadership.
• Nice-to-have: Knowledge of SoC design methodologies, low-power design techniques, and IC physical design impact on thermal/electrical performance.
• Nice-to-have: Familiarity with advanced packaging assembly processes and their electrical/thermal characteristics.
• Nice-to-have: Proficiency with tools such as Ansys IcePak, Sentinel-TI, Fluent, Cadence Allegro, and RedHawk.

Education Requirements

Bachelor's degree required. Field of study not specified; the posting does not state equivalent-experience language or specific certifications.

About the Company

Company: Apple

Headquarters: Cupertino, California, United States

Apple is a multinational technology company that designs, manufactures, and sells consumer electronics, software, and online services. Known for its innovative products such as the iPhone, Mac computers, and iPad, Apple emphasizes a strong commitment to high-quality design and user experience.