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SoC Static Timing Analysis (STA) Engineer, HBM

Micron Technology
October 5, 2026
Full-time
On-site
Richardson, Texas, United States
$198,000 - $337,000 USD yearly
Physical Design Jobs, Level - Senior

Job Title

SoC Static Timing Analysis (STA) Engineer, HBM

Role Summary

As an STA Engineer in the Heterogeneous Integration Group (HIG), you will own chip-level timing sign-off for next-generation HBM die. You will partner with RTL, physical design, architecture, DFT, verification, and product teams to ensure timing integrity from initial design through tape-out.

Experience Level

Senior-level; requires 10+ years of hands-on chip-level STA and multiple tape-outs at 5nm or below.

Responsibilities

Primary responsibilities include timing sign-off, constraint development, and automation:

  • Own end-to-end chip-level static timing analysis and sign-off across checks, modes, corners, voltages, and temperatures.
  • Develop, validate, and maintain sign-off quality Synopsys Design Constraints (SDC) for clocks, resets, HBM interfaces, DFT, and configuration logic.
  • Drive timing closure at block, subsystem, and full-chip levels via critical path analysis, ECOs, and collaboration with physical design on placement, CTS, and routing.
  • Perform multi-mode, multi-corner analysis including CDC timing, OCV/AOCV/POCV, and advanced-node timing methodologies.
  • Lead signal integrity and crosstalk analysis and partner with physical design teams on mitigation strategies.
  • Build and maintain STA automation and flows using Python and Tcl for reporting, regression tracking, and sign-off readiness.
  • Conduct post-silicon timing correlation and define organization-wide STA methods, sign-off standards, and readiness reviews.
  • Mentor junior engineers and clearly communicate timing status, risks, and closure plans to cross-functional teams and senior management.

Requirements

Must-have qualifications and preferred skills:

  • Must-have: 10+ years of hands-on experience owning chip-level STA and full timing sign-off on multiple tape-outs at 5nm or below.
  • Must-have: Deep experience with Synopsys PrimeTime and/or Cadence Tempus.
  • Must-have: Expert understanding of multi-mode multi-corner analysis, on-chip variation, signal integrity, and power-aware timing.
  • Must-have: Proven ability to develop and manage complex hierarchical SDC constraints for large SoCs with multiple clock and power domains.
  • Must-have: Proficiency in Python and/or Tcl for timing flow automation, constraint management, and quality-of-results reporting.
  • Preferred: Experience with HBM, DRAM, or memory-centric SoC designs.
  • Preferred: Exposure to DFT timing (scan, MBIST, JTAG) and chiplet/3D IC timing methodologies.
  • Preferred: Familiarity with foundry PDKs, Liberty timing models, and advanced noise/variation modeling.
  • Preferred: Strong communication skills and willingness to work with or learn agentic AI to help develop efficient workflows.

Education Requirements

Not specified.


About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.

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Date Posted: 2026-10-03