SMTS Device Modeling & Characterization

Job Title

SMTS Device Modeling & Characterization

Role Summary

Engineer on the Ultra-Low-Power CMOS modeling team developing compact (SPICE) models for FDSOI, FinFET and Bulk MOSFET technologies used in GF Process Design Kits (PDKs). The role focuses on device characterization, model development and correlation to hardware for digital, analog and RF/MMW applications, collaborating across sites.

Experience Level

Senior — role expects significant industry experience (guidance in Education Requirements: PhD +8 years or Master’s +12 years).

Responsibilities

Accountabilities include leading model development and characterization efforts, collaborating with cross-site teams, and communicating technical results.

• Lead SPICE/compact model development projects and strategic initiatives.
• Design MOSFET characterization structures for compact model extraction.
• Develop compact models for FDSOI, FinFET and Bulk technologies, including RF/MMW use cases.
• Develop models for emerging devices (MRAM, RRAM) where applicable.
• Perform device analysis, model-to-hardware correlation, and K/CpK analysis.
• Analyze test data, debug device and measurement issues, and prepare technical reports.
• Coach and mentor team members; lead cross-functional and cross-site collaborations.
• Support EHS requirements and participate in technical committees and external programs as needed.

Requirements

Technical and interpersonal skills expected for successful performance.

• Must-have: Strong semiconductor device physics knowledge, especially MOSFET behavior and characterization.
• Must-have: Experience with compact (SPICE) model development and model-to-hardware correlation.
• Must-have: Experience designing test/characterization structures and interpreting measurement data.
• Must-have: Familiarity with model extraction tools and workflows (examples: MBP, ICCAP) and industry model families (e.g., BSIM).
• Must-have: Experience with RF/MMW device characterization and modeling is highly desirable.
• Must-have: Proven ability to lead technical projects, mentor engineers, and work across sites.
• Nice-to-have: Hands-on process development, measurements & characterization experience; MRAM/RRAM modeling experience.
• Nice-to-have: Knowledge of Fully Depleted SOI (FDSOI) and FinFET device behaviors and related extraction techniques.

Education Requirements

PhD in Electrical, Electronics or Device Engineering (preferred) or Master’s in Electrical or Electronics Engineering. The posting indicates experience expectations tied to degree: PhD with ~8+ years of relevant experience or Master’s with ~12+ years of relevant experience.

About the Company

Company: GlobalFoundries

Headquarters: Saratoga Springs, New York, USA

GlobalFoundries is a leading contract manufacturer for the global semiconductor industry, with facilities in multiple countries, including the USA. The company develops a broad portfolio of semiconductor technologies and employs around 13,000 people worldwide. GlobalFoundries focuses on enhancing competitiveness in specialized application solutions and fostering innovation in mobile communications, consumer electronics, and automotive applications.