SMT Technology Expert (Soldering & PCB assembly)

Job Title

SMT Technology Expert (Soldering & PCB assembly)

Role Summary

Lead technical authority for diagnosing and resolving complex SMT soldering and PCB assembly issues encountered at customer sites. Responsible for root-cause failure analysis, process and materials optimization, reflow profile development, and providing Design-for-Manufacturing feedback to R&D and packaging teams.

Experience Level

Senior-level role — requires significant industry experience (guidance: 8+ years of relevant hands-on SMT/process engineering experience).

Responsibilities

Provide technical leadership across customer support, process optimization, and design guidance to improve first-pass yield and long-term reliability.

• Serve as primary technical contact for SMT issues reported by customers (examples: tombstoning, voiding, head-in-pillow, cold joints, opens, excessive warpage).
• Perform root-cause analysis of field failures and document corrective actions.
• Develop, optimize, and validate reflow oven profiles (soak zone, peak temperature, TAL) for chip packages such as QFN, BGA, LGA.
• Evaluate and select solder materials including solder paste types (Type 4/5/6 powders), alloys, and fluxes appropriate to pad design and component pitch.
• Define stencil design specifications (aperture, thickness, step-down, nano-coating) to improve paste release and reduce voiding.
• Review and approve PCB landing pad designs (SMD/NSMD) and advise on substrate design and surface finishes to prevent solderability issues.
• Collaborate with Package and R&D engineers on package-to-board interactions and NPI for SMT assembly.
• Provide on-site technical support and training to manufacturing partners and customers as required.
• Perform other assigned tasks related to SMT process improvement and reliability.

Requirements

Must-have experience and skills listed below. Nice-to-have items indicate additional differentiators.

• Must-have: 8+ years of hands-on SMT process engineering experience in the semiconductor, OSAT, or EMS industries.
• Must-have: Proven experience in failure analysis for soldering defects and implementing corrective actions.
• Must-have: Practical skills in reflow profile development and thermal/process optimization for QFN, BGA, LGA and similar packages.
• Must-have: Experience selecting solder pastes, alloys, and fluxes; knowledge of stencil design and paste release issues.
• Must-have: Familiarity with PCB surface finishes and solderability concerns (examples: NiAu, ENIG, ENEPIG, OSP, Immersion Ag).
• Must-have: Ability to communicate technical findings to customers and internal teams; experience leading technical troubleshooting on-site.
• Nice-to-have: Experience influencing IC package design early in development and establishing internal SMT assembly standards for NPI.
• Nice-to-have: Prior work with high-volume manufacturing environments and cross-functional collaboration with packaging/R&D groups.

Education Requirements

Bachelor’s or Master’s degree in Mechanical Engineering, Materials Science, Electronics Engineering, or a related field.

About the Company

Company: Monolithic Power Systems

Headquarters: San Jose, California, USA

Monolithic Power Systems, Inc. (MPS) is a leading provider of energy-efficient power solutions for various applications, including industrial, telecom, automotive, and consumer sectors. Known for their cutting-edge integrated power semiconductors, MPS emphasizes innovation, sustainability, and creativity, making them one of the fastest-growing companies in the semiconductor industry.