Silicon Photonics Advanced Packaging Intern (Summer 2027)

Job Title

Silicon Photonics Advanced Packaging Intern (Summer 2027)

Role Summary

Summer intern role supporting development of electro-optical transceivers and advanced co-packaged optics using GF's Photonix platform. The role focuses on chip-package co-design across thermal, mechanical, electrical and optical domains to improve module performance, reliability, and manufacturability.

This is a hands-on engineering internship working with cross-functional teams and external OSAT partners from concept through production readiness.

Experience Level

Entry-level internship for current undergraduate or graduate students. No prior professional years-of-experience required; suitable for students seeking summer work experience in semiconductor packaging or photonics.

Responsibilities

The intern will support packaging design, analysis, and qualification activities. Key responsibilities include:

• Support advanced packaging design rule definition, product requirement definition, and manufacturing enablement with internal teams and OSAT partners.
• Participate in cross-functional design reviews and help resolve technical, manufacturability, reliability, and yield issues for new products.
• Develop and apply analysis or simulation models to evaluate package performance, manufacturability, cost, and quality; document results and recommendations.
• Contribute to qualification robustness and continuous improvement plans and track requirements from concept through production readiness.
• Follow Environmental, Health, Safety & Security requirements and perform work safely.

Requirements

Must-have and preferred qualifications for successful candidates.

• Must-have: Ability to work at least 40 hours per week during the internship.
• Must-have: English fluency (written and verbal).
• Must-have: Able to travel up to 10%.
• Nice-to-have: Prior internship, research, or co-op experience in semiconductor packaging, photonics, optics, or advanced electronics.
• Nice-to-have: Exposure to thermal, mechanical, electrical, optical, or multiphysics simulation tools.
• Nice-to-have: Knowledge of semiconductor packaging, chiplets, silicon photonics, or co-packaged optics.
• Nice-to-have: Demonstrated leadership in projects or student organizations, strong communication, planning and project-management skills.
• Nice-to-have: Interest in using AI tools and emerging technologies to improve productivity and decision-making.

Education Requirements

Actively pursuing a Bachelor’s or Master’s degree in Electrical Engineering, Mechanical Engineering, Materials Science, Photonics, Optical Engineering, Packaging Engineering, or a related technical field in an accredited program. Candidates must have at least a 3.0 overall GPA and be in good academic standing during the internship.

About the Company

Company: GlobalFoundries

Headquarters: Saratoga Springs, New York, USA

GlobalFoundries is a leading contract manufacturer for the global semiconductor industry, with facilities in multiple countries, including the USA. The company develops a broad portfolio of semiconductor technologies and employs around 13,000 people worldwide. GlobalFoundries focuses on enhancing competitiveness in specialized application solutions and fostering innovation in mobile communications, consumer electronics, and automotive applications.