Silicon Packaging Technology Engineer

Job Title

Silicon Packaging Technology Engineer

Role Summary

Join Reality Labs to develop and productize advanced silicon packaging solutions for next-generation wearable consumer hardware. The role focuses on translating packaging concepts into manufacturable, reliable products that meet tight performance, power, and form-factor constraints.

The engineer will lead packaging technology development, coordinate with foundries and OSATs, and collaborate with silicon, mechanical, thermal, and systems teams to ensure integration and production readiness.

Experience Level

Senior — 12+ years of experience in advanced silicon packaging development, process integration, and manufacturing.

Responsibilities

Key responsibilities include driving packaging technology from concept to production and ensuring manufacturability and reliability.

• Lead development and roadmap creation for advanced packaging technologies (e.g. hybrid bonding, TSV, fan-out, SiP, flip chip, SMT, solder ball attach).
• Establish and manage relationships with foundries, OSATs, substrate and material suppliers to support package development.
• Influence partner roadmaps and align external suppliers with internal packaging requirements.
• Collaborate cross-functionally with silicon design, architecture, thermal, mechanical, and system teams to ensure integration and manufacturability.
• Support test vehicle design, process feasibility, simulation, and design rule/DFM checks with emphasis on thermo-mechanical reliability.
• Plan and execute Design of Experiments (DOEs) for initial builds, qualification, and sustaining activities.
• Lead triage for inline process, equipment, and quality issues; drive root-cause failure analysis and corrective actions with partners.
• Evaluate chip-package interaction (CPI), board-level and component-level reliability through simulation, testing, and data analysis.
• Track technology gaps, reliability risks, yield issues and maintain POR, TOR, FMEA, and related KPIs.
• Travel domestically and internationally up to ~10% to support supplier engagements and qualifications.

Requirements

Must-have skills and experience are listed first; preferred items follow.

• Must-have: 12+ years' experience in advanced silicon packaging development, process integration, and manufacturing.
• Must-have: Demonstrated experience taking packaging concepts to prototyping and production, including vendor qualification, manufacturing specifications, and yield/cost optimization.
• Must-have: Proven cross-functional collaboration with internal teams and external partners (foundries, OSATs, substrate vendors, ODMs).
• Must-have: Ability to co-optimize package architecture under mechanical and thermal constraints for demanding form factors.
• Must-have: Experience planning and executing DOEs, process characterization, and analyzing reliability data.
• Must-have: Experience leading failure analysis activities and driving corrective actions with manufacturing partners.
• Nice-to-have: Experience with board-level and component-level reliability testing and qualification to industry standards.
• Nice-to-have: Familiarity with a broad range of packaging technologies (WLCSP, fan-out RDL, WoW, CoW, PoP, SiP, flip chip, 3D stacking).
• Nice-to-have: Strong statistical analysis and DOE methodology; ability to manage multiple programs independently.

Education Requirements

Bachelor's degree in Computer Science, Computer Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, Chemical Engineering, or a related technical field — or equivalent practical experience. Master's or PhD in a relevant engineering discipline is preferred.

About the Company

Company: Meta Platforms

Headquarters: Menlo Park, California, United States

American technology company that develops social networking products (Facebook, Instagram, WhatsApp) and invests in virtual/augmented reality hardware and software through Reality Labs, focusing on connectivity, advertising, and immersive computing experiences.