Silicon Packaging Design Engineer
Intel CorporationJob Title
Silicon Packaging Design Engineer
Role Summary
As a Silicon Packaging Design Engineer in the Data Center Group, you will develop substrate designs from concept through tapeout with emphasis on performance, manufacturability, cost and time-to-market. You will work closely with silicon, hardware, and cross-functional teams to optimize silicon-package-board integration and deliver production-ready designs.
Experience Level
Entry-level. Guidance: approximately 6 months or more of experience in semiconductor packaging or PCB design.
Responsibilities
Primary responsibilities include design, layout, verification, and documentation of substrate and package designs.
- Drive complete substrate development from initial concept through tapeout.
- Perform physical layout and routing of package designs, adhering to design requirements.
- Conduct substrate fit and routing studies to balance design, performance, and cost.
- Collaborate with silicon and hardware teams on silicon-package-board optimization and pinout configuration.
- Define and implement substrate design rules to meet product and manufacturing requirements.
- Perform internal and external design reviews, analyze data, and resolve design rule violations (DRCs).
- Integrate design documentation and collateral into the product lifecycle management system.
- Identify and implement improvements for manufacturability (DFM) and quality assurance.
Requirements
Must-have technical skills and experience; preferred items listed separately.
- Minimum 6 months of work experience in semiconductor packaging or PCB-related design.
- Novice to intermediate proficiency in substrate design, physical layout, and routing.
- Basic understanding of I/O fundamentals, package interconnect, and power delivery principles.
- Familiarity with design for manufacturability (DFM) and quality assurance processes.
- Strong problem-solving skills and a disciplined approach to execution.
- Ability to participate in and act on internal and external design reviews.
- On-site work model; role requires presence at the Bangalore site.
Nice-to-have:
- Experience with E-CAD tools.
- Effective technical communication and cross-functional collaboration skills.
- Proactive approach to identifying design improvements.
Education Requirements
Diploma in Electronic or Electrical Engineering or a related field (as specified in the posting).
About the Company
Company: Intel Corporation
Headquarters: Santa Clara, California, USA
Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.
