Silicon Packaging Design Engineer

Job Title

Silicon Packaging Design Engineer

Role Summary

Design and deliver complex test boards and package-board integrations from concept through tapeout to support silicon package validation and characterization. The role partners with package design, test engineering, validation, and manufacturing teams to ensure electrical, mechanical, performance, and manufacturability targets are met.

Experience Level

Senior — requires advanced experience; minimum guidance: 10+ years in PCB layout and board design with multi-site collaboration responsibilities.

Responsibilities

Primary duties include full lifecycle board design, verification, and release for test and validation hardware.

• Drive end-to-end development of test board designs from concept through tapeout.
• Perform board planning, floor planning, routing studies, and physical layout implementation.
• Conduct fit and routing studies addressing performance, manufacturability, and cost tradeoffs.
• Partner with package design, test engineering, and validation teams to define board requirements and optimize package-board interactions.
• Develop and validate board connectivity and ensure compliance with project specifications.
• Execute design rule checks (DRCs) and resolve manufacturing design rule issues.
• Lead internal and external design reviews and drive resolution of design issues.
• Coordinate with board fabrication and assembly vendors for design approval and manufacturing readiness.
• Define and maintain board design guidelines, standards, and best practices.
• Create and maintain design documentation and release collateral within PLM systems.
• Support root cause analysis and troubleshooting of board and package-board integration issues.

Requirements

Must-have technical skills and experience; preferred items are noted separately.

• 10+ years of PCB layout experience using Cadence Allegro and Cadence Constraint Manager.
• 5+ years' experience in hardware development including schematic entry, signal integrity, power delivery, constraint entry, library creation, DFM/DFX.
• Proven ability to manage highly complex PCB designs both independently and as part of distributed teams.
• Expertise in board design, interconnect methodologies, and manufacturability principles.
• Practical experience with board design rules and resolving DRC violations.
• Experience collaborating with board fabrication/assembly vendors and supporting manufacturing readiness.
• Strong analytical, troubleshooting, and technical leadership skills.

Education Requirements

Master's degree in Electrical Engineering or Mechanical Engineering required.

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.