Signal Integrity Engineer

Job Title

Signal Integrity Engineer

Role Summary

Work on high-speed interconnect, PCB and package breakout design, simulation, and validation to ensure signal and power integrity for advanced ASIC platforms. Collaborate with ASIC packaging teams, internal layout teams, ODMs, and vendors across design, verification, and post-silicon bring-up.

This is a hybrid role based out of Santa Clara, CA, Austin, TX, or Toronto, ON focused on end-to-end SI/PI work for 10 Gbps+ interfaces and modern connector and material technologies.

Experience Level

Mid-level. The role expects roughly 5+ years of experience in high-speed digital design (guidance provided in the posting; candidates at various levels may be considered during interviews).

Responsibilities

Primary responsibilities include design, simulation, and validation of high-speed interconnects and supporting production bring-up.

• Design, extract, and simulate complex breakout structures and perform end-to-end SI/PI simulations validated against hardware.
• Generate board models for SI and PI, perform extraction and simulation for signal and power integrity analysis.
• Contribute to design and sign-off with internal and external ASIC packaging teams, ODMs, and internal layout groups.
• Create design specifications, engage external vendors, and drive adoption of new interconnect and packaging technologies.
• Participate in design reviews and provide SI/PI insight from a system perspective.
• Support post-silicon bring-up, troubleshoot production and field failures related to SI/PI, and correlate lab results with simulations.
• Document design processes and provide training and knowledge transfer to team members.

Requirements

Key must-have skills and experience. Degree requirements are summarized separately below.

• 5+ years of experience in high-speed digital design focused on PCB or package design at 10 Gbps and above (examples: 100GbE, GDDR6, PCIe Gen5+).
• Practical experience with SI/PI simulation and extraction workflows and board-model correlation.
• Familiarity with high-speed performance metrics (ICR, ERL, COM, NEXT, FEXT) and high-speed connector technologies (NPO, CPO, and emerging standards).
• Proficient with PCB ECAD tools; experience with Cadence Allegro is preferred.
• Strong written and verbal communication, critical thinking, and cross-team collaboration skills.
• Experience supporting lab validation, post-silicon bring-up, and field failure analysis.
• Ability to produce clear design specifications and work with external vendors and manufacturing partners.
• Must be eligible to access U.S. export-controlled technology; offers may be conditional on citizenship, permanent residency, or required license approvals under U.S. export laws.

Education Requirements

Bachelor's degree in Electrical Engineering, Electronics, or a related technical field, or equivalent practical experience.

About the Company

Company: Tenstorrent

Headquarters: Austin, Texas, United States

Tenstorrent is a technology company focused on designing innovative computing solutions. They are known for their expertise in the development of advanced hardware, including ASICs and SoCs, aimed at enhancing performance and efficiency in various applications.