Signal Integrity Engineer

Job Title

Signal Integrity Engineer

Role Summary

Work on signal- and power-integrity (SI/PI) analysis and sign-off for high-speed parallel interfaces across IC, package, interposer, and PCB domains, including 2.5D and 3D technologies. Collaborate with R&D, IP development, customers, and manufacturing partners to develop and qualify next-generation ASIC interconnects and interfaces.

Experience Level

Mid-level — this role expects several years of practical SI/PI engineering experience (typically multiple years of relevant industry experience in high-speed interface analysis and sign-off).

Responsibilities

Primary responsibilities include technical analysis, tool automation, and documentation for SI/PI sign-off of parallel interfaces.

• Perform mask-based timing sign-off using time-domain simulations (SPICE and similar) for parallel interfaces, including 2.5D and 3D designs.
• Perform electromagnetic extraction and build models for signal and power delivery channels across PCB, package, and interposers.
• Conduct AC and transient analysis of power-distribution networks (PDN).
• Perform IO channel analysis and pre-layout modeling of transceivers and PDN networks.
• Develop automation for sign-off flows and collaborate with EDA vendors to improve tool accuracy and analysis processes.
• Generate analysis results, produce presentations and sign-off reports, and support pre-sales and internal teams with technical material.

Requirements

Must-have technical skills and capabilities; listed concisely.

• Proven SI/PI experience with high-speed parallel interface sign-off workflows.
• Experience with time-domain simulation tools and EM extraction/modeling tools.
• PDN AC and transient analysis experience and IO channel analysis skills.
• Experience with pre-layout modeling of transceivers and signal/PDN networks.
• Practical scripting ability (TCL, Python) to automate tasks and flows.
• Familiarity with IC, package, and PCB database formats and working with those data types.
• Ability to manage multiple concurrent customers and deliver analysis, documentation, and presentations on tight timelines.
• Ability to work independently across global teams and with manufacturing partners and customers.

Nice-to-have: hands-on experience with 2.5D/3D interconnect technologies, familiarity with DDR/LPDDR/HBM sign-off flows, and previous collaboration with EDA vendors to tune tools and flows.

Education Requirements

Bachelor's degree in Electrical, Electronics, or Computer Engineering with 8+ years of related experience, or a Master's degree in those fields with 6+ years of related experience.

About the Company

Company: Broadcom

Headquarters: Irvine, California, United States

Broadcom is a global technology leader that designs, develops, and supplies a wide range of semiconductor and infrastructure software solutions. The company is known for its innovations in wireless and broadband communications, enabling a connected world.