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Signal Integrity Engineer

Broadcom
August 25, 2026
Full-time
On-site
San Jose, California, United States
$143,800 - $230,000 USD yearly
Physical Design Jobs, Level - Senior

Job Title

Signal Integrity Engineer

Role Summary

Perform signal- and power-integrity analysis and sign-off for next-generation ASIC products, with emphasis on parallel interfaces and multi-die interconnects (MCM, 2.5D, 3D). Work with R&D, IP teams, customers, and manufacturing partners to deliver validated designs and improve analysis flows.

Experience Level

Senior β€” expects 10+ years of related experience for candidates with a Master's degree or 12+ years with a Bachelor's degree.

Responsibilities

Primary responsibilities include:

  • Mask-based timing signoff using time-domain simulations (SPICE, etc.) for parallel interfaces including 2.5D and 3D.
  • Electromagnetic extraction and modeling of signal and power delivery channels (PCB, package, interposers).
  • AC and transient analysis of power distribution networks (PDN).
  • IO channel analysis and pre-layout modeling of transceivers and PDN networks.
  • Automate sign-off processes and collaborate with EDA suppliers to improve tool accuracy and analysis flow.
  • Generate analysis results, create presentations and sign-off reports, and support pre-sales and customer interactions.

Requirements

Must-have technical skills and attributes:

  • Extensive SI/PI sign-off experience and familiarity with sign-off flow tool suites for DDR/LPDDR and/or HBM.
  • Experience with electromagnetic extraction and modeling across IC, package, and PCB domains.
  • AC and transient PDN analysis capability and IO channel analysis experience.
  • Proficiency in scripting (TCL, Python) to automate routine tasks and sign-off processes.
  • Experience working with various IC, package, and PCB database types.
  • Ability to manage multiple concurrent customer projects, meet short timelines, and present results clearly.
  • Independent self-starter comfortable working across a worldwide organization.

Nice-to-have:

  • Hands-on experience with 2.5D/3D interconnect technologies and MCM design.
  • Experience collaborating with manufacturing partners and improving EDA tool flows.

Education Requirements

Bachelor's degree with 12+ years of related experience, or Master's degree with 10+ years of related experience. Degree fields are not specified; related technical/engineering experience is acceptable.


About the Company

Company: Broadcom

Headquarters: Irvine, California, United States

Broadcom is a global technology leader that designs, develops, and supplies a wide range of semiconductor and infrastructure software solutions. The company is known for its innovations in wireless and broadband communications, enabling a connected world.

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Date Posted: 2026-08-25