SiGe HBT Device Modelling Intern (Summer 2027)
GlobalFoundriesJob Title
SiGe HBT Device Modelling Intern (Summer 2027)
Role Summary
Collaborate with an RF device modeling team to develop compact HiCUM L2 V3.0 models for advanced SiGe HBT devices, validate models against DC and RF measurements, and model high-current and non‑quasistatic phenomena. The role focuses on device characterization, parameter extraction, and communicating technical results to the team.
Experience Level
Entry-level internship for graduate students. Targeted at students currently pursuing a Master's or PhD (see Education Requirements). Availability to work 20–40 hours per week during the internship is required.
Responsibilities
Primary responsibilities include device characterization, compact model development, and presentation of results.
- Analyze DC and RF measurement data and compare with simulations.
- Develop HiCUM L2 V3.0-based compact models for SiGe HBT devices.
- Extract compact-model parameters representing advanced device physics.
- Model and validate effects such as avalanche at high current densities and non‑quasistatic behavior against measurement data.
- Define procedures to incorporate new physical effects into compact models and propose new modeling methods when applicable.
- Present technical results to the project/technical team upon completion.
- Perform work following Environmental, Health, Safety & Security requirements.
Requirements
Minimum requirements and preferred skills for candidates.
- Must-have: English fluency (written and verbal); availability to work 20–40 hours per week during the internship.
- Preferred technical skills: Semiconductor device physics and characterization knowledge; familiarity with device compact models and HiCUM; experience with circuit/simulation tools such as Cadence Spectre or Keysight ADS; familiarity with Cadence Virtuoso or similar layout tools.
- Preferred analytical & software skills: Data analysis and problem solving; experience with scripting and high-level languages (Python, Matlab/R, Perl) and shell scripting.
- Preferred professional skills: Prior related internship or co-op experience, demonstrated leadership, project management, strong written and verbal communication, and organizational skills.
Education Requirements
At least a second-year graduate student actively pursuing a Master’s or PhD in Electrical Engineering, Microelectronics, or a related technical field in an accredited program during the internship. Minimum overall GPA of 3.5 and in good academic standing.
About the Company
Company: GlobalFoundries
Headquarters: Saratoga Springs, New York, USA
GlobalFoundries is a leading contract manufacturer for the global semiconductor industry, with facilities in multiple countries, including the USA. The company develops a broad portfolio of semiconductor technologies and employs around 13,000 people worldwide. GlobalFoundries focuses on enhancing competitiveness in specialized application solutions and fostering innovation in mobile communications, consumer electronics, and automotive applications.
