SI/PI Member of Technical Staff

Job Title

SI/PI Member of Technical Staff

Role Summary

Perform signal and power integrity (SI/PI) engineering for high-speed transmission lines, packages, and substrates. Lead SI/PI analysis, collaborate with package designers and substrate suppliers, and support development of substrate/package technology and test vehicles.

Experience Level

Mid-level — typically requires 5+ years of relevant SI/PI or electromagnetic experience; 3+ years when holding an advanced degree.

Responsibilities

Primary responsibilities include design analysis, cross-functional collaboration, and supplier interaction.

• Lead SI/PI analysis for high-speed interfaces and transmission-line design.
• Collaborate with package and substrate designers to optimize materials and processes.
• Develop and validate power distribution network (PDN) strategies and mitigations.
• Perform S-parameter and Z-parameter modeling and frequency-/time-domain analysis (Fourier/FFT).
• Design, evaluate, and optimize I/O equalization (FIR, CTLE, DFE, FFE) and IBIS power-aware models.
• Plan and execute lab measurements using oscilloscopes, BERTs, TDR, VNA, spectrum analyzers, and probe stations.
• Automate analysis and data processing using scripting or programming languages.

Requirements

Core technical skills and tool experience required.

• Strong foundation in electromagnetics, microwave theory, transmission lines, and PDNs.
• Experience with S-parameters, Z-parameters, and Fourier analysis.
• Practical experience with IBIS power-aware modeling and high-speed I/O equalization techniques.
• Familiarity with Cadence tools, ANSYS HFSS/3D, ANSYS SIWave, and Synopsys HSPICE.
• Hands-on test and measurement experience: MSO/DSO oscilloscopes, BERT, TDR, VNA, spectrum analyzer, probe station.
• Programming/scripting skills (C, C++, Perl, Python or similar) for analysis automation.
• Demonstrated ability to work cross-functionally and with external suppliers.

Education Requirements

B.S. in Engineering is the baseline for candidates with approximately 5+ years of experience. An advanced degree (e.g., M.S., Ph.D.) may be accepted with approximately 3+ years of relevant experience. Relevant fields include Electrical Engineering, Computer Engineering, Physics, or related technical disciplines.

About the Company

Company: Chipletz

Headquarters: Austin, TX, USA

Chipletz develops advanced semiconductor packaging and heterogeneous integration solutions, focusing on chiplet-based packages, design verification, and validation for high-performance electronics.