Job Title
Senior Yield Analysis Engineer — Advanced Packaging
Role Summary
Join the Advanced Packaging Technology and Manufacturing (APTM) Yield Group to drive yield and defect improvement across packaging technologies from development through high-volume manufacturing. The role focuses on analyzing large datasets, diagnosing process and test failures, and delivering actionable recommendations to improve yield.
Experience Level
Senior. Typical expectation: approximately 6+ years of relevant industry experience (varies by background).
Responsibilities
Primary responsibilities include data-driven yield improvement, cross-functional collaboration, and communicating results to engineering and manufacturing partners.
- Analyze structured and unstructured data sets using statistical methods and machine learning to identify yield drivers and defects.
- Develop solutions using knowledge of manufacturing processes, test content, and inline metrology.
- Drive recommendations and influence the yield-improvement roadmap and action plans.
- Correlate electrical and physical failures across FIFA, DFT, Sort/Test, and integration/process flows.
- Use data-mining, databases, data manipulation, and visualization to present clear findings.
- Prepare timely reports summarizing yield and device health and define required actions to reach target yield levels.
- Work with Process Engineering, Integration, QNR, Product and Test teams to enable successful technology development, transfer, and ramp to HVM.
- Support domestic and international travel as needed for transfers, ramps, or cross-site collaboration.
Requirements
Must-have technical skills and experience to perform the role effectively.
- Hands-on data analysis experience (e.g., JMP, Python, or similar) — demonstrated ability to manipulate and interpret large datasets.
- Proficient in statistical analysis and applied data science methods for yield improvement.
- Experience with data-mining, databases, data visualization, and data manipulation tools.
- Understanding of manufacturing test flows, Sort/Test data interpretation, and defect analysis methods.
- Strong analytical, communication, and presentation skills; able to influence cross-functional teams and work autonomously.
- Proven problem-solving and structured technical troubleshooting skills.
- Willingness to travel domestically and internationally as required.
Nice-to-have:
- Familiarity with product/circuit/architecture details relevant to yield analysis.
- Hands-on knowledge of inline defect metrology and detection capabilities.
Education Requirements
Bachelor's degree + ≥6 years relevant experience, or Master's degree + ≥4 years, or PhD + ≥2 years in Materials Science and Engineering, Mechanical Engineering, Computer Science, Information Systems, Chemical Engineering, Electrical Engineering, Chemistry, Physics, or a related field; or equivalent practical experience.
About the Company
Company: Intel Corporation
Headquarters: Santa Clara, California, USA
Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.

Date Posted: 2026-08-04