Senior Thermal Simulation Engineer, HBM

Job Title

Senior Thermal Simulation Engineer, HBM

Role Summary

Join the Heterogeneous Integration Group within Technology and Products to develop thermal and thermo-mechanical models for next-generation High Bandwidth Memory (HBM) packages. The role supports product development by predicting thermal behavior, identifying risk, and guiding package and system-level thermal design decisions.

Experience Level

Senior-level. The posting specifies an MS plus 3 years of relevant experience or a PhD (see Education Requirements).

Responsibilities

Execute physics-based thermal and coupled multiphysics simulations and translate results into actionable design recommendations.

• Develop high-fidelity thermal and thermo-mechanical models for HBM packages, including dies, interconnects, bonding interfaces, and system integration.
• Perform coupled multiphysics simulations (thermal, structural, and coupled analyses) to evaluate performance and identify risks.
• Analyze thermal transport, heat flux distribution, hotspots, and thermo-mechanical behavior in stacked memory architectures.
• Drive simulation-to-silicon correlation with characterization and test teams to validate and refine models.
• Evaluate material properties, layout effects, and package architecture impacts on thermal resistance and hotspot behavior.
• Collaborate with design, packaging, process, and test teams to enable thermally-aware product development.
• Develop modeling methodologies and scalable simulation frameworks for HBM and advanced packaging.

Requirements

Must-have technical skills and domain experience for successful execution of the role.

• Experience in thermal simulation or multiphysics modeling within semiconductor or advanced packaging domains.
• Strong foundation in heat transfer, thermodynamics, and solid mechanics.
• Hands-on experience with multiphysics and FEM tools such as Ansys, Abaqus, Fluent, Star-CCM+, FloTHERM, or equivalent.
• Ability to model and interpret thermo-mechanical phenomena including thermal resistance, heat spreading, stress, and material interactions.
• Experience with simulation-to-silicon correlation and working with characterization/test teams.
• Nice-to-have: familiarity with semiconductor packaging technologies (HBM, 2.5D/3D integration, TSVs, hybrid bonding, interposers).
• Nice-to-have: exposure to CFD or flow-based simulation for cooling and package-level heat transfer.
• Nice-to-have: scripting or data-analysis skills (Python, MATLAB, JMP) to automate simulations and analyze results.

Education Requirements

MS plus three years of relevant experience, or a PhD, in Mechanical Engineering, Materials Science, Physics, or a related technical field.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.