Senior Technologist, Hybrid Bonding Module

Job Title

Senior Technologist, Hybrid Bonding Module

Role Summary

As a Senior Technologist for die-to-wafer hybrid bonding (HBI), you will drive process and equipment development for next-generation hybrid bonding technologies. You will develop first-of-a-kind platforms and optimize processes for manufacturing to improve module performance, yield, reliability, and operational efficiency.

Experience Level

Senior. See Education Requirements for degree-and-years combinations; the role expects substantial industry experience in hybrid bonding and advanced packaging.

Responsibilities

Accountable for development, optimization, and industrialization of die-to-wafer hybrid bonding processes and equipment.

• Drive process and equipment development for die-to-wafer hybrid bonding: materials selection, parameter optimization, equipment characterization, and process control.
• Develop and optimize manufacturing processes to improve yield, reliability, and defectivity.
• Improve bond interface quality, alignment performance, overlay accuracy, surface preparation, and contamination control.
• Design and execute DOE-based experiments and perform statistical analysis to establish robust process windows and control strategies.
• Lead first-of-a-kind (FOK) process and equipment capability development for new bonding platforms and technologies.
• Identify and implement process and equipment improvements to enhance manufacturing capability, efficiency, and throughput.
• Conduct process feasibility studies using characterization, modeling, simulation, and experimental methodologies.
• Partner with equipment suppliers and materials vendors to develop enabling process and hardware solutions.
• Collaborate with technology development, process integration, and manufacturing organizations to drive process maturity and continuous improvement.
• Contribute to future technology roadmaps through evaluation of emerging hybrid bonding technologies.

Requirements

Must-have and preferred skills, technologies, and experience for this role.

• (Must-have) 5+ years of industry experience in hybrid bonding, wafer bonding, advanced packaging, or closely related semiconductor manufacturing technologies.
• (Must-have) Deep technical expertise in hybrid bonding process or equipment engineering and hands-on experience optimizing manufacturing processes.
• (Must-have) Experience designing and analyzing DOE experiments and applying statistical methods to define process control strategies.
• (Must-have) Experience with process characterization, metrology, defect inspection, or failure analysis techniques in a manufacturing environment.
• (Must-have) Strong written and verbal communication skills and the ability to present technical findings to diverse audiences.
• (Must-have) Ability to influence cross-functional teams, mentor engineers, manage multiple priorities, and drive results in a fast-paced environment.
• (Preferred) Experience leading first-of-a-kind process or equipment development programs and transferring technology to manufacturing.
• (Preferred) Knowledge of bond interface defect mechanisms (voids, adhesion, contamination) and overlay/alignment optimization.
• (Preferred) Experience improving equipment capability, throughput, utilization, and collaborating with external suppliers and materials vendors.

Education Requirements

Degrees and fields: Bachelor's, Master's, or PhD in Materials Science, Electrical Engineering, Chemical Engineering, Physics, or a related engineering/scientific field. Degree-and-years guidance from the posting: Bachelor's with 9+ years, Master's with 6+ years, or PhD with 4+ years of relevant experience. The posting also specifies 5+ years of industry experience in hybrid bonding, wafer bonding, advanced packaging, or closely related semiconductor manufacturing technologies.

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.