Senior Systems Semiconductor Packaging Engineer

Job Title

Senior Systems Semiconductor Packaging Engineer

Role Summary

Lead development of advanced semiconductor packaging solutions for MEMS sensors across product lifecycle from concept through manufacturing readiness. Translate product and customer requirements into robust, scalable packages while improving manufacturability, reliability, and time to market.

Experience Level

Senior-level. Preferred guidance in the posting: typically 5+ years of relevant semiconductor packaging, process development, or manufacturing engineering experience.

Responsibilities

Deliver packaging designs, drive manufacturability and reliability, and coordinate with internal teams and external vendors to bring products to production.

• Lead package design projects from concept through manufacturing release.
• Drive design for manufacturability and reliability via process characterization and risk assessment.
• Perform root cause analysis and yield-improvement activities with quality and reliability teams.
• Use 3D CAD and simulation tools (e.g., SolidWorks, ANSYS) for mechanical and process analysis.
• Apply process and quality methods: PFMEA, DOE, SPC, 8D, RCA, and control plans.
• Partner with Applications Engineering to translate customer requirements into technical direction.
• Collaborate with OSATs and external vendors for prototyping, qualification, and assembly readiness.
• Coordinate cross-functionally to resolve issues and support product launches.
• Travel approximately 10% to support vendor collaboration and prototype activities.

Requirements

Key must-have skills and competencies, plus preferred experience.

• Must-have: Strong experience in semiconductor packaging and manufacturing processes supporting development from concept to release.
• Must-have: Practical materials knowledge (substrates, adhesives, underfills, mold compounds, interconnects).
• Must-have: Experience applying reliability and manufacturability principles to package design and qualification readiness.
• Must-have: Hands-on experience with 3D CAD and engineering-analysis tools such as SolidWorks and ANSYS.
• Must-have: Demonstrated structured problem solving using DOE, PFMEA, SPC, 8D, RCA.
• Must-have: Strong cross-functional collaboration and clear technical communication skills.
• Nice-to-have: Experience with MEMS/sensor packaging, working with OSAT partners, or advanced package development.

Education Requirements

Bachelor's or Master’s degree in Mechanical Engineering, Materials Science, Electrical Engineering, or a related technical field. Relevant industry experience is also considered where candidates demonstrate equivalent skills and performance.

About the Company

Company: Analog Devices

Headquarters: Norwood, Massachusetts, USA

Analog Devices is a leading global semiconductor company that bridges the physical and digital worlds, enabling breakthroughs at the Intelligent Edge. With a focus on innovation, ADI develops solutions that drive advancements in digitized factories, mobility, and digital healthcare. The company employs around 24,000 people globally and reported revenues exceeding $9 billion in FY24, creating technologies that transform lives across various sectors.