Senior SW/CAD Engineer - Physical Design

Job Title

Senior SW/CAD Engineer - Physical Design

Role Summary

Join the CES-3DIC team in New Cairo to develop software and automation for advanced 2.5D/3D System-in-Package (SiP) and ASIC physical design. The role focuses on integrating EDA and MCAD tools, implementing physical implementation and packaging flows, and supporting multi-die analysis (electrical, thermal, mechanical) and manufacturing test workflows.

Experience Level

Senior — typically requires several years of relevant CAD/physical-design software experience (see Education Requirements for specific years-of-experience guidance).

Responsibilities

Primary responsibilities include developing and maintaining software and automation for physical implementation and packaging flows, and managing EDA infrastructure.

• Design, implement, test, and document software modules and subsystems for physical design, place-and-route, and 3D packaging.
• Develop scalable automation and workflow solutions using Python, Tcl/Tk, Bash and related scripting.
• Identify and resolve complex physical design, packaging, tool, or workflow issues.
• Improve flows and methodologies for advanced nodes with focus on performance, power, and area (PPA) optimization.
• Support integration of floorplanning, placement, routing, power integrity, signal integrity, CTS/timing closure, and physical verification flows for 3D ICs and advanced packaging.
• Collaborate with CAD, packaging, and physical implementation teams to define and deliver workflow requirements.
• Contribute to 3D IC/3DStack architecture and standards-based solution development.
• Manage design data and EDA infrastructure, including tool installation/upgrades, server environment setup (Linux/Windows), resource monitoring, and troubleshooting.

Requirements

Must-have technical skills and experience; preferred items listed separately.

• Must-have: Strong scripting skills in Python, Tcl/Tk, and Shell/Bash.
• Practical software development experience with data structures and development on Windows and Linux.
• Experience with flow managers and Makefiles for building complex design structures and workflows.
• Proficiency in design data management and EDA infrastructure (organizing large-scale design data, installing/upgrading EDA tools, managing server environments).
• Deep understanding of ASIC physical design methodologies from RTL synthesis through netlist-to-GDS physical implementation (floorplanning, placement, routing, CTS, timing closure, physical verification).
• Familiarity with version control systems (e.g., Git) and software development methodologies (Agile/Scrum).
• Ability to work independently and collaboratively with minimal supervision; advanced English communication skills.

• Nice-to-have: Hands-on experience with commercial place-and-route and physical verification tools (e.g., Cadence Innovus, Synopsys Fusion Compiler/ICC2, Siemens Aprisa, Calibre); package design and interposer planning tools; IC analysis tools (HyperLynx, Ansys HFSS, RedHawk, Voltus, PrimeTime); experience with 3D IC/3DStack solutions; knowledge of advanced process nodes (FinFET).

Education Requirements

Bachelor's degree with 4+ years' experience, or a Master's degree with 2+ years' experience, in Computer Science, Computer Engineering, Electrical Engineering, or a closely related technical field.

About the Company

Company: Siemens

Headquarters: Munich, Germany

Siemens EDA is a leading global provider of Electronic Design Automation (EDA) products and systems. Their innovative solutions enable companies to enhance the development of electronic products efficiently and effectively, keeping pace with the complex demands of technology and physics. Siemens is committed to delivering advanced workflow solutions that integrate both EDA and MCAD tools for multi-domain design and manufacturing in the semiconductor industry.