Senior Staff, Technical Program Management - Power Package NPI

Job Title

Senior Staff, Technical Program Management - Power Package NPI

Role Summary

Own execution of Renesas' AI/datacenter power package engineering and NPI programs from development and qualification through production ramp. Lead cross-functional program execution with package engineering, power product teams, and OSAT/CM partners to deliver schedules, quality, reliability, and production readiness.

Role requires driving risk mitigation, technical task forces, program governance, and concise communication with senior leadership.

Experience Level

Senior-level. The posting requests 12+ years of relevant experience in semiconductor engineering, product development, package development, NPI, manufacturing, or technical program management.

Responsibilities

Primary program management and technical leadership duties include:

• Lead end-to-end NPI program execution for AI/datacenter power package projects, defining plans, milestones, critical path, and resources.
• Manage cross-functional coordination with Package Engineering, Product Engineering, Reliability, Quality, Operations, Supply Chain, and Power product teams.
• Work with OSAT/CM partners to align development activities, DOE, process optimization, qualification, and ramp readiness.
• Identify, escalate, and drive mitigation for technical, quality, reliability, yield, manufacturability, cost, and schedule risks.
• Lead cross-functional technical task forces and drive root-cause analysis and corrective/preventive actions to closure.
• Establish program dashboards, metrics, and governance to provide transparent visibility into milestones, risks, and recovery plans.
• Ensure timely execution of Engineering Build Requests (EBRs) and manage transitions from development to volume manufacturing.
• Provide concise, data-based updates and recommendations to directors and senior leadership.
• Translate strategic package technology roadmaps into executable programs, staffing recommendations, and team objectives.

Requirements

Must-have skills and experience:

• 12+ years of relevant semiconductor engineering or technical program management experience, including leading complex cross-functional NPI programs.
• Demonstrated experience with package development, assembly, qualification, reliability, and manufacturing ramp.
• Hands-on experience with power products such as power SiP/modules, Smart Power Stages, Power Modules, discrete FET packages, PMICs, or related technologies.
• Experience working with OSATs/CMs across distributed organizations and driving partner accountability.
• Strong program management skills: critical-path management, risk management, executive escalation, schedule recovery, and resource alignment.
• Proficiency in statistical/process control, qualification/reliability methods, and structured problem solving.
• Excellent communication, negotiation, and stakeholder-management skills; ability to influence without direct authority.
• Willingness to travel approximately 10–20% domestically and internationally.

Nice-to-have:

• Experience with wide-bandgap devices (SiC/GaN), DBC/AMB substrates, multi-chip or advanced interconnect technologies.
• Experience with formal technical program management methodologies and portfolio-level governance.
• Experience supporting high-growth, high-visibility customer programs.

Education Requirements

Bachelor’s degree or higher in Electrical, Mechanical, Chemical, or Materials Engineering; Materials Science; Physics; Chemistry; or a related technical discipline.

About the Company

Company: Renesas

Headquarters: Hitachinaka, Japan

Renesas is a global leader in embedded semiconductor solutions, providing high-quality products across automotive, industrial, infrastructure, and IoT sectors. With over 22,000 employees in more than 30 countries, the company focuses on scalable solutions that enhance user experience and drive innovation while committed to sustainability and energy efficiency.