Senior Staff, Technical Program Management, Power Package NPI

Job Title

Senior Staff, Technical Program Management, Power Package NPI

Role Summary

Lead end-to-end execution of Renesas' AI/datacenter power package engineering and New Product Introduction (NPI) programs from development and qualification through production ramp. Work closely with Package Engineering leadership, Power product teams, and OSAT/CM partners to deliver schedules, product quality, reliability, and production readiness.

Experience Level

Senior-level. Role requires senior leadership responsibility and program ownership; the position expects 12+ years of relevant semiconductor/product development and NPI experience.

Responsibilities

Manage complex, cross-functional NPI and package engineering programs and lead technical execution and escalation.

• Lead program-level execution for AI/datacenter power package NPI, establishing plans, milestones, critical path, and resource alignment.
• Provide governance and accountability while keeping technical ownership clear with Package Engineering leadership and product teams.
• Establish and operate a disciplined NPI program model covering development, qualification, production readiness, ramp, and handoff to volume manufacturing.
• Identify and mitigate technical, quality, reliability, manufacturing, supply, and schedule risks; escalate critical issues with clear recommendations.
• Lead cross-functional technical task forces to resolve issues impacting quality, reliability, yield, manufacturability, qualification, or schedule.
• Drive root-cause analysis, corrective/preventive actions, and ensure closure of critical actions.
• Coordinate with Design, Product Engineering, Reliability, Quality, Operations, and Supply Chain to remove execution barriers.
• Build and maintain program dashboards that show milestones, critical path, risks, owners, and recovery plans.
• Collaborate with OSAT/CM partners on DOE, process optimization, process-window verification, production controls, and qualification readiness.
• Ensure Engineering Build Requests (EBRs) execute on schedule at OSATs and drive recovery actions for delays.
• Translate strategic priorities into executed programs, milestones, resources, and deliverables for package technology roadmaps.
• Translate organizational priorities into team objectives, staffing recommendations, performance expectations, and development plans; foster urgency and cross-functional ownership.

Requirements

Key qualifications and skills required to perform the role effectively.

• Must-have: 12+ years of relevant experience in semiconductor engineering, package development, NPI, manufacturing, technical program management, or closely related fields, including leading complex cross-functional programs.
• Must-have: Demonstrated experience managing semiconductor NPI programs involving package development, assembly, qualification, reliability, and ramp to production.
• Must-have: Strong understanding of semiconductor product development and package/assembly processes; hands-on experience with power management products (e.g., power SiP/modules, smart/vertical power stages, power modules, discrete FET packages, PMICs, wafer-level or flip-chip technologies).
• Must-have: Experience working with OSATs/CMs and managing distributed development and production activities; proven track record resolving quality, reliability, yield, manufacturability, and schedule issues.
• Must-have: Strong program management skills: critical-path management, risk management, executive escalation, schedule recovery, and cross-functional resource alignment.
• Must-have: Knowledge of qualification, reliability, SPC/statistical methods, process development, risk management, and structured problem-solving.
• Must-have: Strong interpersonal, communication, negotiation, and presentation skills, with ability to influence senior leaders without direct authority.
• Must-have: Willingness to travel domestically/internationally approximately 10–20% to OSAT/CM sites.

Nice-to-have:

• Experience supporting high-growth, high-visibility customer programs and formal technical program management methodologies or portfolio governance.
• Familiarity with wide-bandgap devices (SiC/GaN), DBC/AMB substrates, multi-chip or advanced interconnect technologies.

Education Requirements

Bachelor's degree or higher in Electrical, Mechanical, Chemical, or Materials Engineering; Materials Science; Physics; Chemistry; or a related technical discipline.

About the Company

Company: Renesas

Headquarters: Hitachinaka, Japan

Renesas is a global leader in embedded semiconductor solutions, providing high-quality products across automotive, industrial, infrastructure, and IoT sectors. With over 22,000 employees in more than 30 countries, the company focuses on scalable solutions that enhance user experience and drive innovation while committed to sustainability and energy efficiency.