Senior/Staff/Principal - Advanced Packaging TD Integrator

Job Title

Senior/Staff/Principal - Advanced Packaging TD Integrator

Role Summary

Responsible for developing and integrating advanced packaging process solutions across technode development, ensuring new processes, equipment, materials and path-finding activities succeed for Micron's advanced packaging products.

Lead process readiness, characterization, qualification and transfer to small-volume production while collaborating with cross-functional teams to resolve process issues and meet schedule and yield targets.

Experience Level

Senior - typically 5+ years of semiconductor industry experience, with technical leadership in process integration and qualification.

Responsibilities

Key activities and deliverables for this role include:

• Develop and qualify new packaging processes, materials, equipment and technologies to meet technode requirements and schedules.
• Lead process characterization, recipe development and optimization to improve yield, quality and reliability.
• Perform CPI NUDD, process TRA, silicon characterization and risk mitigation to ensure first-pass success.
• Drive transition from development and qualification to small-volume production.
• Introduce and integrate new materials, machines and technologies; identify path-finding opportunities to reduce time-to-market and cost.
• Integrate process knowledge between frontend (Si) and backend (assembly/packaging) and manage chip-package interactions.
• Collaborate with cross-functional teams to troubleshoot and resolve process-related problems.
• Provide timely technical solutions aligned with product and customer requirements.

Requirements

Must-have skills and experience; nice-to-have items noted where applicable.

• Minimum 5 years of experience in the semiconductor industry with hands-on integration or process development experience.
• Experience with backend advanced packaging wafer- or die-level processes and integration.
• Understanding of silicon integration and chip-package interactions at the backend process level.
• Proficiency in simulation tools and data analytics platforms for performance analysis and process optimization.
• Strong project management, communication and presentation skills; ability to work across functions and lead technical projects to schedule.
• Familiarity with temporary/permanent bonding technologies (wafer-on-wafer, chip-on-wafer) - nice to have.
• Experience in frontend fab process integration or module process - nice to have.
• Ability to apply artificial intelligence and automation tools to daily tasks and project workflows - desirable.

Education Requirements

PhD, Master's or Bachelor's degree in Electrical & Electronic Engineering, Materials, Mechanical Engineering, Physics, Applied Physics or a closely related technical field; equivalent practical work experience acceptable.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.