Senior Staff Package Design Engineer

Job Title

Senior Staff Package Design Engineer

Role Summary

Design and qualify semiconductor package and interconnect solutions focused on power SiP/modules, wafer-level and flip-chip packaging, and related assembly processes. Work with product, reliability, quality, operations and external assembly partners (OSAT/CM) to develop, qualify and ramp packages for consumer, industrial and automotive power applications.

Experience Level

Senior — typically more than 10 years of relevant package development and qualification experience.

Responsibilities

Accountable for package selection, development, qualification and transition to production with emphasis on quality and ramp.

• Benchmark, select and qualify materials, processes and assembly subcontractors (OSAT) or contract manufacturers (CM).
• Work with OSAT/CM to design and run DOE to optimize processes, establish process specs and resolve process issues during ramp.
• Lead qualification of new packages and processes; coordinate with Product and Reliability teams to meet timelines and resolve customer issues.
• Ensure smooth transition into production and implement ramp-up monitoring.
• Develop and maintain package design rules and documentation.
• Drive packaging roadmap execution and maintain technical expertise on power SiP/modules, wafer-level, flip-chip and panel-level packaging innovations.

Requirements

Must-have technical skills and experience.

• Extensive experience in package development with emphasis on power SiP/module, wafer-level and flip-chip packaging.
• Practical knowledge of assembly processes, qualification methods, SPC and statistical analysis tools.
• Experience collaborating with OSATs/CMs and managing process optimization and production ramp.
• Ability to design and interpret DOE and statistical studies.
• Strong interpersonal, communication, analytical and presentation skills.
• Nice-to-have: experience with wire-bonding, multi-chip modules, GaN-related packaging technologies.

Education Requirements

Doctorate, Master’s or Bachelor’s degree in Physics, Chemistry, Mechanical, Electrical or Materials Engineering (Doctorate/Master’s/Bachelor’s degree explicitly listed in source).

About the Company

Company: Renesas

Headquarters: Hitachinaka, Japan

Renesas is a global leader in embedded semiconductor solutions, providing high-quality products across automotive, industrial, infrastructure, and IoT sectors. With over 22,000 employees in more than 30 countries, the company focuses on scalable solutions that enhance user experience and drive innovation while committed to sustainability and energy efficiency.