Senior/Staff Equipment Development Engineer (APTD)

Job Title

Senior/Staff Equipment Development Engineer (APTD)

Role Summary

Lead development and optimization of advanced packaging and post-probe wafer/die processing equipment to enable process capability, cost reduction, and high-volume manufacturing. Work cross-functionally to define hardware roadmaps, qualify new equipment and materials, and drive transitions from development to production.

Experience Level

Senior — requires 5+ years of semiconductor process or equipment engineering experience.

Responsibilities

The role drives equipment strategy, design, qualification, and production transition for packaging and assembly processes.

• Develop and optimize wafer-level packaging and stacking equipment (e.g., TC bonder/Hybrid Bonder) including wafer bonding, plating, and warpage control.
• Define and maintain 5+ year hardware roadmaps for post-probe wafer and die processing.
• Evaluate, qualify and promote new equipment and materials to extend process capabilities.
• Improve equipment capability, yield, productivity, and cost through hardware and process changes.
• Establish equipment management projects to meet technology node requirements and ensure defense coverage via measurement, inspection, and testing.
• Lead cross-functional equipment teams and coordinate with Package Integration, PWF/Assembly Engineering, Front End Wafer Fab, Assembly/Test, Product Engineering, and Global Quality.
• Manage transitions from new product development and qualification to small-volume and high-volume production.
• Perform continuous data analysis and implement advanced controls in collaboration with SMAI teams.
• Construct forecasts, proposals and strategic/tactical plans informed by business data and market intelligence.

Requirements

Must-have technical skills and experience, plus preferred skills.

• 5+ years semiconductor process or equipment engineering experience, preferably with wafer bonding, plating, warpage control and packaging stacking processes.
• Experience in equipment development and improving maturity of First‑of‑a‑Kind (FOAK) hardware.
• Strong data analytics skills to support SPC, DOE, defect analysis, and dashboarding.
• Familiarity with equipment/process control systems such as E3, FDC (Fault Detection and Classification), and RMS (Recipe Management System).
• Ability to lead cross-functional teams and drive product transitions to high-volume manufacturing.
• Preferred: proficiency in Python, R, SQL for statistical analysis and process modeling.
• Preferred: experience with Visual Basic for automation and tool integration.
• Nice-to-have: knowledge of semiconductor processing and solid-state device physics.
• Demonstrated problem-solving and root-cause analysis track record.

Education Requirements

B.S., M.S., or Ph.D. (or equivalent education) in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, or a related technical field. The posting also permits equivalent education or practical experience in lieu of a listed degree.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.