Job Title
Senior Staff Engineer, Multiphysics
Role Summary
Customer-facing engineering role to integrate multiphysics simulation into Synopsys signoff flows for advanced packaging, 3DIC, HBM, and chiplet designs. The role works with Korean semiconductor customers and global R&D to enable production adoption of unified electrical, thermal, mechanical, and EM-aware signoff flows.
Experience Level
Senior β typically 8+ years of relevant hands-on experience in multiphysics simulation, semiconductor signoff, or advanced packaging and 3DIC design.
Responsibilities
Provide customer enablement, build production flows, and translate production issues into actionable R&D priorities.
- Deploy and enable RedHawk-SC, RedHawk-SC ET, Totem-SC, HFSS, and HFSS-PI at Korean semiconductor and foundry customers.
- Build and validate end-to-end flows integrating Synopsys EDA tools (Fusion Compiler, StarRC, PrimeTime, PrimePower) with Ansys multiphysics platforms for electrical, thermal, mechanical, and EM co-analysis.
- Provide hands-on technical support for advanced packaging, 3DIC, HBM5, and chiplet interconnect designs to solve tapeout challenges.
- Develop production-grade reference flows and benchmarks that improve turnaround time, accuracy, and design closure efficiency.
- Translate customer requirements and production roadblocks into prioritized R&D feedback and roadmap items.
- Automate workflows and tool integration using Tcl and Python.
- Represent the company in technical reviews, proof-of-concept engagements, and customer-facing presentations in Korean and English.
Requirements
Technical must-haves for successful performance in this role. Degree and formal education expectations are listed under Education Requirements.
Must-have:
- Proven hands-on experience with multiphysics simulation and semiconductor signoff (EM, thermal, mechanical, fluid, or coupled-domain; IR-drop, electromigration, SI/PI, thermal analysis).
- Production or customer-facing experience with tools such as Ansys HFSS, RedHawk-SC (including RedHawk-SC ET), Icepak, Fluent, or equivalent.
- Strong understanding of physical design and signoff flows and how analysis results affect tapeout decisions.
- Proficiency in Tcl and Python for automation and tool integration.
- Fluency in Korean and English and ability to present technical results to customers and global teams.
- Experience working independently at customer sites and coordinating with global R&D teams; strong diagnostic and problem-solving skills.
Nice-to-have:
- Experience with GPU-accelerated simulation, AI-driven optimization, or chiplet interconnect standards such as UCIe.
- Familiarity integrating Synopsys EDA tools (Fusion Compiler, StarRC, PrimeTime, PrimePower) with multiphysics platforms for end-to-end signoff.
Education Requirements
MS or PhD in Electrical Engineering, Mechanical Engineering, Applied Physics, Computational Science, or a related field; or a Bachelor's degree with equivalent industry depth or equivalent practical experience.
About the Company
Company: Synopsys
Headquarters: Mountain View, California, USA
Synopsys is a leading company in electronic design automation (EDA) and semiconductor IP solutions. It provides tools and services for designing and verifying complex semiconductor devices and systems. The company plays a pivotal role in the semiconductor industry, helping engineers innovate and deliver higher-quality products faster. Synopsys is committed to advancing technology standards and offers a range of software and hardware solutions to its clients globally.

Date Posted: 2026-06-07