Senior Staff Advanced Packaging Engineer

Job Title

Senior Staff Advanced Packaging Engineer

Role Summary

Lead end-to-end package design execution for complex, chiplet-based and heterogeneous integration products. Drive package layout, bump maps, and interposer designs while improving design methodologies through automation and AI-driven techniques. Work cross-functionally with SI/PI, mechanical, SoC teams, OSATs, foundries, and substrate suppliers to deliver production-ready designs.

Experience Level

Senior (staff-level). The posting does not specify a years-of-experience range.

Responsibilities

Primary responsibilities include hands-on design delivery, technical leadership, and cross-functional coordination.

• Lead package design execution, ensuring performance, cost, quality, and schedule targets are met.
• Manage multiple concurrent design programs in fast-paced, high-pressure environments.
• Develop substrate layouts, bump maps, and interposer designs for 2.5D/3D and chiplet architectures.
• Drive design decisions in collaboration with SI/PI, mechanical, and SoC teams.
• Partner with OSATs, foundries, and substrate vendors to deliver optimized solutions.
• Communicate design status, risks, and mitigation strategies to stakeholders; contribute to design reviews, signoff readiness, and tapeout processes.
• Define and improve package design methodologies, flows, reuse, and standardization.
• Mentor junior engineers and promote engineering best practices across the team.
• Apply AI/ML and automation to improve design productivity and quality.

Requirements

Must-have technical skills and experience are listed first; preferred items follow.

• Must-have: Proven experience in advanced package or silicon physical design and execution for complex products.
• Must-have: Hands-on experience with EDA tools for package/layout and practical workflow automation.
• Must-have: Experience working with OSATs, foundries, and substrate vendors; ability to drive supplier collaboration.
• Must-have: Solid understanding of signal integrity (SI) and power integrity (PI) fundamentals.
• Must-have: Demonstrated ownership, ability to operate with minimal supervision, and strong cross-functional influence.
• Preferred: Experience with substrate design, silicon bridge, or interposers.
• Preferred: Track record executing in multi-project, fast-phased environments.
• Preferred: Experience applying AI/ML, automation, or advanced workflows to package design.
• Preferred: Mentoring and leadership experience.

Education Requirements

Bachelor's or higher degree in Electrical Engineering, Computer Engineering, or a related technical field.

About the Company

Company: Advanced Micro Devices

Headquarters: Sunnyvale, California, USA

Advanced Micro Devices, or AMD, is a global semiconductor company that designs and manufactures microprocessors, graphics processors, and related technologies for a variety of computing devices. Known for pushing the boundaries of innovation, AMD's mission is to deliver high-performance computing solutions for AI, data centers, gaming, and embedded applications. They foster a collaborative, inclusive culture focused on creativity and problem-solving, aiming to drive progress and excellence in technology.