Senior Signal Integrity Engineer – Cryogenic Interconnects

Job Title

Senior Signal Integrity Engineer – Cryogenic Interconnects

Role Summary

Senior engineer responsible for signal-integrity modeling, simulation, and lab characterization of cryogenic interconnects and multi-layer PCB systems to enable ultra-high-speed communication. Works with SI, materials, mixed-signal, and system teams to define specifications and drive end-to-end interconnect performance.

Experience Level

Senior-level. Typical guidance: 5+ years of relevant experience in signal integrity, EM simulation, or high-frequency interconnect design.

Responsibilities

Design, simulate, and validate interconnect solutions used in cryogenic and extreme environments. Key responsibilities include:

• Develop accurate 3D electromagnetic models for PCBs and interconnect structures using tools such as HFSS.
• Simulate multi-layer PCB designs under cryogenic conditions and assess performance impacts.
• Define high-speed constraints, SI specifications, and design guidelines across RF, materials, and thermal domains.
• Drive next-generation cryogenic interconnect solutions for ultra-high-speed communication.
• Perform lab characterization and validation using network analyzers and high-speed measurement equipment.
• Correlate simulation results with hardware measurements and refine models for improved accuracy.
• Collaborate cross-functionally with PCB, package, materials, mixed-signal, and system teams to resolve integration issues.

Requirements

Concise list of required technical skills and experience; degree requirements are listed separately in Education Requirements.

Must-have

• 5+ years of relevant experience in signal integrity modeling, simulation, and validation.
• Strong experience with SI/EM tools such as HFSS or equivalent.
• Deep understanding of high-frequency / broadband design and multi-layer PCB signal behavior.
• Knowledge of PCB materials and their electrical/physical properties and how they affect SI.
• Hands-on lab experience with vector network analyzers (VNA) and high-speed characterization equipment.
• Ability to correlate simulation and measurement data to improve models.
• Interest or background in cryogenic technologies and their impact on interconnect performance.

Nice-to-have

• Experience with low-loss or ultra-high-speed interconnect design.
• Materials modeling experience or expertise in SI–material correlation.
• Experience designing for extreme environments (cryogenic, thermal, reliability-driven).
• Proven track record of cross-functional collaboration across PCB, package, and system domains.

Education Requirements

MS or PhD in Electrical Engineering preferred, or equivalent practical experience. (The source explicitly allows equivalent experience in lieu of the listed degrees.)

About the Company

Company: NVIDIA

Headquarters: Santa Clara, California, USA

NVIDIA is a global leader in accelerated computing, renowned for its innovative solutions in AI and digital twins that transform diverse industries. The company specializes in networking technologies, providing end-to-end InfiniBand and Ethernet solutions for servers and storage that optimize performance and scalability. NVIDIA serves sectors such as high-performance computing, enterprise data centers, and cloud computing, constantly reinventing its products and services to stay ahead in the market.