Job Title
Senior Signal Integrity Engineer
Role Summary
As a Senior Signal Integrity / Power Integrity engineer you will own SI/PI analysis for high-speed PCBs, packages, and system architectures from early architecture trade-offs through lab bring-up and characterization. Collaborate with hardware, ASIC, SERDES, packaging, and layout teams to develop models, optimize designs, and validate results.
Experience Level
Senior β 12+ years of relevant practical experience in high-speed digital design, signal integrity, and power integrity.
Responsibilities
Primary responsibilities include modeling and simulation, PDN analysis, design optimization, lab validation, and debugging during bring-up.
- Build 2.5D/3D EM models for high-speed channels, package substrates, connectors, and PCB stackups; perform time- and frequency-domain simulations for SerDes and parallel interfaces.
- Perform AC/DC PDN simulations to evaluate impedance targets, transient noise, and IR drop across boards and packages.
- Provide layout constraints, stackup recommendations, routing rules, and optimized package/connector/via designs.
- Validate and correlate simulation models with lab measurements using VNAs, TDRs, BERTs, and high-bandwidth oscilloscopes.
- Support board bring-up and debug SI/PI issues to root-cause signal degradation or power noise.
- Automate simulation flows and data processing using scripting (e.g., Python, TCL).
Requirements
Must-have technical skills and experience.
- 12+ years practical experience in high-speed digital design, signal integrity, and power integrity.
- Strong fundamentals in transmission line theory, S-parameters, crosstalk, jitter, EMI/EMC, and PDN concepts.
- Hands-on proficiency with simulation tools such as Ansys HFSS/SiWave, Cadence Sigrity/Allegro, Keysight ADS, or HSPICE.
- Experience simulating and analyzing high-speed interfaces (e.g., PCIe, 56G/112G/224G SerDes, DDR4/5, HBM).
- Experience operating high-frequency test equipment and performing model-to-hardware correlation (VNAs, TDRs, BERTs, scopes).
Nice-to-have:
- Familiarity with high-speed PCB laminates, stackups, via design, and manufacturing trade-offs.
- Experience writing Python or TCL scripts to automate EDA tools and simulation workflows.
Education Requirements
BS, MS, or Ph.D. in Electrical Engineering, Computer Engineering, or a related technical field.
About the Company
Company: Broadcom
Headquarters: Irvine, California, United States
Broadcom is a global technology leader that designs, develops, and supplies a wide range of semiconductor and infrastructure software solutions. The company is known for its innovations in wireless and broadband communications, enabling a connected world.

Date Posted: 2026-08-17