Senior Signal Integrity Engineer

Job Title

Senior Signal Integrity Engineer

Role Summary

Lead board-level high-speed electrical design and validation for 1.6T DR8 (200G/lane) OSFP optical modules. Provide technical leadership across multiple projects, drive cross-functional decisions, and mentor the SI team to deliver production-ready module designs.

Experience Level

Senior — typically 15–20 years of relevant high-speed SI/PI and board-level design experience as stated in the role.

Responsibilities

Primary responsibilities include architecture, simulation, validation, and technical leadership for dense multi‑lane optical module PCBs.

• Define SI/PI architecture, channel budgets, interface architectures, and design rules for 200G PAM4 lanes from ASIC/DSP to front panel.
• Lead pre- and post-layout SI/PI simulations and sign-off (S-parameters, PAM4 eye analysis, COM, crosstalk, jitter, PDN impedance) for multi-lane channels.
• Specify PCB stack-ups, materials (ultra-low-loss laminates), via/breakout strategies, connector choices, and routing guidelines to meet performance, cost, and manufacturability targets.
• Drive cross-functional trade-offs with hardware, optics, mechanical, firmware, and test teams balancing SI/PI needs with thermal and mechanical constraints.
• Lead lab correlation and validation plans: fixture/board design, TDR/VNA/BERT/oscilloscope measurements, de-embedding, and sign-off criteria for engineering and production builds.
• Lead root-cause analysis and resolution of SI-related proto and field issues; recommend design and process improvements.
• Establish and maintain company-wide SI/PI methodologies, checklists, and documentation for current and future OSFP/QSFP-class platforms.
• Mentor and coach junior and mid-level SI/hardware engineers; review and approve simulations, reports, and design decisions.

Requirements

Must-have technical skills and experience for immediate contribution.

• Deep expertise in very high-speed SerDes (≥56G; strong preference for 100G/200G PAM4): channel modeling, equalization, jitter/crosstalk analysis, and margining.
• Extensive hands-on experience with SI/PI tools such as Sigrity, ADS, HFSS, SIwave, HSPICE or equivalent, including scripting/automation for simulations and reports.
• Proven track record of taking complex high-speed hardware or optical modules from concept through production, including multiple design spins and volume manufacturing support.
• Strong lab skills with high-bandwidth oscilloscopes, VNAs, BERTs, and TDRs; ability to correlate measurements with simulations and manage external labs/vendors.
• Demonstrated ability to lead cross-functional design reviews and communicate complex SI/PI concepts to technical and non-technical stakeholders.

Nice-to-have:

• Direct experience with OSFP/OSFP-XD/QSFP-DD transceiver designs at 800G/1.6T or similar data-center interconnects.
• Familiarity with IEEE 802.3 DR8/FR8/LR8 and relevant MSAs/OIF specifications.
• Background in EMI/EMC and mechanical/thermal impacts on pluggable modules.
• Experience managing or technically leading small SI/PI or hardware teams.

Education Requirements

B.E./B.Tech or M.E./M.Tech (or equivalent) in Electrical/Electronics Engineering, or equivalent practical experience in high-speed SI/PI and board-level design.

About the Company

Company: Lumilens

Headquarters: San Jose, CA, USA

Lumilens develops integrated photonics and optical interconnect solutions for high-speed data communication and chip-to-chip interfaces, focusing on optical front-end hardware and co-packaged optics for advanced semiconductor systems.