Senior RF Electromagnetic (EM) Engineer

Job Title

Senior RF Electromagnetic (EM) Engineer

Role Summary

Work on advanced semiconductor package system design and technology for high-performance products, focusing on multi-physics simulation, package-to-system analysis, lab validation, and manufacturing qualification for new product introduction (NPI).

Collaborate with multidisciplinary teams, vendors, and IP groups to define package/system specifications that meet electrical, thermal, mechanical, reliability, and cost targets.

Experience Level

Senior-level. The posting indicates experienced engineers; preferred experience examples include 3+ years in system/package design (see Education Requirements for formal experience/degree combinations).

Responsibilities

Primary responsibilities include design, analysis, validation, and qualification of package systems and integration technologies.

• Lead package system design and architecture selection for discrete packages and Module/SiP (single or multi-die).
• Perform multi-physics simulations (thermal, electrical, mechanical) and optimize designs for performance, reliability, and cost.
• Support package-to-system electrical analysis for digital/analog IP and PDN across SoC, substrate, interposer, and components.
• Develop cooling and thermal solutions and validate thermal performance through simulation and lab testing.
• Simulate and evaluate mechanical interactions, materials, and reliability impacts.
• Execute empirical testing, characterize materials/devices, and correlate lab data with models.
• Drive development, evaluation, and qualification of substrate, 2.5D/3D integration, and high-density interconnect technologies.
• Support design verification (DV), tapeout preparation, and manufacturing qualification during NPI.
• Collaborate with cross-functional teams and external partners to meet project objectives and quality targets.

Requirements

Core technical skills and professional competencies required for successful performance in the role.

• Practical experience in package/system design and multi-physics simulation tools (thermal, electrical, mechanical).
• Experience with package electrical analysis (digital, analog, PDN) and board/system level interactions.
• Hands-on lab validation experience and the ability to correlate measurements with simulation models.
• Knowledge of substrate technologies, heterogeneous integration (2.5D/3D, interposers, bridge die), and high-density interconnect techniques.
• Experience with design verification, tapeout flows, and manufacturing qualification processes for semiconductor packages.
• Strong problem-solving, written and verbal communication, and teamwork skills.
• Nice-to-have: prior work on SiP/module development, die stacking (die-to-wafer, die-to-die, wafer-to-wafer) techniques, and DRM/process development.
• Nice-to-have: demonstrated ability to influence technical decisions across teams.

Education Requirements

Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or a related field plus 2+ years of relevant system/package design experience; OR Master’s degree in those fields plus 1+ year of relevant experience; OR PhD in Chemical, Electrical, Mechanical Engineering, or a related field. Preferred: Master’s degree and 3+ years of system/package design or related experience.

About the Company

Company: Qualcomm

Headquarters: San Diego, California, United States

Qualcomm is a global leader in semiconductor and telecommunications equipment, specializing in mobile technologies and innovations. Known for its Adreno GPUs, the company provides solutions enabling advancements in mobile gaming, AI, VR/AR, and autonomous driving. Qualcomm's cutting-edge technology and commitment to high-performance, power-efficient designs drive the evolution of mobile graphics and connectivity worldwide.